Influence of the Polyhedral Oligomeric Silsesquioxane n-Phenylaminopropyl - POSS in the Thermal Stability and the Glass Transition Temperature of Epoxy Resin

Abstract

Abstract:In this study, epoxy nanocomposites containing different fractions of n-phenylaminopropyl (POSS) were prepared. The nanocomposites were studied by transmission electron microscopy (TEM), gel content, dynamicmechanical analysis (DMA) and thermogravimetric analysis (TGA). The parameters for Avrami's equation were calculated from the degradation curves. The dispersions used to form the nanocomposites were effective above 5 wt % of POSS, and the gel content increased with the addition of POSS. The DMA analysis exhibited an increase in the storage modulus (E') and a shifting of T g to higher temperatures upon POSS incorporation. The weight loss indicated that the POSS promoted an increase in thermal stability of the epoxy resin. The Avrami parameters demonstrated that the addition of POSS decreased the Avrami constant (k'), increased the half-life (t 1/2 ) of degradation and promoted changes in the Avrami exponent (n). These results suggest that the increase in the glass transition temperature and thermal stability depend on the reactive groups in the POSS nanoparticles.

POSS nanoparticles as a potential compatibilizer for natural rubber/butadiene rubber blends

“…On the other hand, as represented in the inset of DTGA curve in Figure 8 and T max‐2 in Table 7, thermal degradation temperature is increased as 7°C and 6°C compared to reference blend, for R4 and R5, respectively. It seems that this result is possibly due to a more dimensionally stable structure which forms with the interaction of POSS and elastomer matrix 33 . Another explanation can be that during thermal decomposition, OV‐POSS turns into SiOSi based ceramic structure which protects the underlying material as a physical barrier and limits heat flux to elastomer matrix 34 …”

The Effect of POSS Type on the Shape Memory Properties of Epoxy-Based Nanocomposites

“…Thus, a hybrid organic–inorganic SMP that is based on an epoxy–POSS (EPOSS) nanocomposite material has a great potential for future space applications. The addition of POSS is known also to affect the T g and the Young’s modulus of epoxy-based polymers, and it can improve their mechanical, chemical, thermal, and electrical properties [ 20 , 32 , 34 , 35 , 36 , 37 , 38 , 39 , 40 , 41 , 42 , 43 , 44 , 45 , 46 , 47 , 48 , 49 , 50 ].…”

“…Most of the previous studies of epoxy and POSS have used diglycidyl ether of bisphenol A (DGEBA) resin [ 36 , 37 , 38 , 40 , 41 , 42 , 43 , 44 , 45 , 46 , 47 , 48 , 49 , 50 ]. DGEBA is the most common type of epoxy resin [ 19 ]; it was found to have shape memory properties [ 51 ].…”

“…DGEBA is the most common type of epoxy resin [ 19 ]; it was found to have shape memory properties [ 51 ]. Prior studies focused on the effect of low concentrations of POSS (less than 10 wt.%) on the nanocomposites’ properties [ 19 , 20 , 39 , 40 , 44 , 45 , 46 , 47 , 48 , 49 , 50 ]. There are only few works on the effect of high concentrations of POSS (up to 50 wt.%) [ 32 , 34 , 35 , 41 , 42 , 43 ].…”

Curing and thermal behavior of epoxy resins of hexafluoro - bisphenol –A and bisphenol-A

“…These desirable properties make them widely applicable materials viz for surface coatings, adhesives, corrosion protectants, composites and laminates, encapsulants for semiconductors, insulating materials for electronic devices etc [1][2][3][4][5][6][7][8][9][10] . However the conventional epoxy resins do not exhibit very high thermal resistance, which is a prerequisite for advanced materials.…”