In-situ raman spectroscopy analysis of re-crystallization annealing of diamond turned silicon crystal

Jasinevicius, Renato Goulart; Duduch, Jaime Gilberto; Pizani, P. S.

doi:10.1590/s1678-58782007000100008

Cited by 8 publications

(8 citation statements)

References 11 publications

(9 reference statements)

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“…After annealing, the previously shiny surfaces took on a matte appearance, signifying that the surface roughness increased upon annealing. Similar effects have been characterized previously (Jasinevicius et al, 2007). Etching was performed with an acid mixture that was 60 parts nitric acid to one part hydrofluoric acid by volume, following a similar prescription to the one given by Zawisky et al (2010).…”

Section: Fabrication Processmentioning

confidence: 98%

Measurement and alleviation of subsurface damage in a thick-crystal neutron interferometer

et al. 2019

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The construction is described of a monolithic thick‐crystal perfect silicon neutron interferometer using an ultra‐high‐precision grinding technique and a combination of annealing and chemical etching that differs from the construction of prior neutron interferometers. The interferometer is the second to have been annealed after machining and the first to be annealed prior to chemical etching. Monitoring the interference signal at each post‐fabrication step provides a measurement of subsurface damage and its alleviation. In this case, the strain caused by subsurface damage manifests itself as a spatially varying angular misalignment between the two relevant volumes of the crystal and is reduced from ∼10−5 rad to ∼10−9 rad by way of annealing and chemical etching.

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Section: Fabrication Processmentioning

confidence: 98%

Measurement and alleviation of subsurface damage in a thick-crystal neutron interferometer

et al. 2019

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“…Longer machining time requires an improved temperature stability of the work environment to avoid a degrading of accuracy of the machined shape. The schematic illustration of machining geometry with a round nose tool is depicted in [6]. We can calculate a theoretical profile, which is produced using the round nose tool with a given radius.…”

Section: Nano-machining Setupmentioning

confidence: 99%

Nano-machining for advanced X-ray crystal optics

Zápražný¹,

Korytár²,

Jergel³

et al. 2016

AIP Conference Proceedings

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Abstract. We present our recent technological achievements in development of the nano-machining of active X-ray crystal optics surfaces. This technique uses a single crystal diamond tool with extremely precise and temperature stabilized positioning system. We can prepare various simple (flat, spherical, cylindrical) as well as more complex freeform surfaces (including aspherical ones). The objective is to prepare high-quality surfaces of the desired shape with subnanometer surface roughness and low sub-surface damage of the crystal lattice. The final surface roughness of a flat Ge surface below 0.4 nm (RMS) was achieved for a very slow regime of the processing using feed rates ≤ 0.25 mm/min. At such a slow feed rate, a parasitic surface grating formed due to rastering the diamond tool along the surface was minimized. Surface roughness Ra was reached well below the level of 3 nm stated by the machining device manufacturer in specifications, which is a very good result. The sub-surface damage varied periodically and followed the surface morphology. Raman peak is shifting to higher phonon frequencies in commercially polished sample as in our sample produced using nano-machining which indicates lower compressive local stresses using our technology. The TEM analysis showed an amorphous layer with thickness of ≈30 nm which origin is the subject of our further research. We would like to emphasize that we do not observe any dislocations in the crystalline phase of germanium (110) laying under amorphous layer. We can conclude from our pilot experiments that the diamond tool nano-machining is a promising technology for high-quality surface treatment to replace less homogeneous chemical methods used in production of X-ray channel-cut crystal optics.

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“…This study showed the possibility of the effective and inexpensive use of a method to produce mechanically flexible nanoribbons and fibers for nano and micromechanical and electronic devices. The [24,53,80,81,84,[87][88][89][90][91][92] publications also report the analysis of the chip formation made when studied the ductile mode cutting. Typical electron microscopic images of amorphous chips of silicon [76,81,88] and CaF 2 [90] are presented in Fig.…”

Section: Chips Formation and Structure In Dictile Mode Cutting Of Brimentioning

confidence: 99%

“…7. It should be noted that in studying the chip phase composition as well as the machined surface of semiconductors [1,23,24,74,86,88,89,92,93] the Raman spectroscopy is widely used and not the trans mission electron microscopy, which was widely used in earlier studies [94,95] referring to the ductile mode of cutting semiconductors. The Raman spectroscopy makes it possible to diagnose virtually all existing phases of semiconductors, a labor consuming procedure for the sample preparation is not required and the investiga tions are conducted at ordinary conditions, without the use of vacuum chambers.…”

Section: Chips Formation and Structure In Dictile Mode Cutting Of Brimentioning

confidence: 99%

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Studies of the ductile mode of cutting brittle materials (A review)

Kovalchenko

2013

J. Superhard Mater.

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Theoretical and experimental studies of the ductile mode of cutting brittle materials (semicon ductors, ceramics, and glass) have been considered. The ductile mode of cutting has been based on the implementation of high pressure induced phase transformations in a material machined that followed by a cutting of a transformed amorphous layer, which makes it possible to avoid cracking. Publications on studies of phase transitions in brittle materials in the course of the indentation, scratching, friction, and cutting have been reviewed. It has been shown that the cutting depth, cutting edge radius of a tool, chip thickness, tool cutting edge inclination, and crystallographic orientation of a material machined and dia mond tool as well as a type of lubricoolant are the decisive factors in implementing the ductile mode of cutting. KOVALCHENKO 1 2 Cutting length 3 4 Resistance force, N Fig. 3. Scheme of different modes of removing a brittle material with increasing normal load and cutting depth [42]: elastic (1) and elastoplastic (2) deformations, plastic (3) and brittle (4) removal of the material.

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In-situ raman spectroscopy analysis of re-crystallization annealing of diamond turned silicon crystal

Cited by 8 publications

References 11 publications

Measurement and alleviation of subsurface damage in a thick-crystal neutron interferometer

Measurement and alleviation of subsurface damage in a thick-crystal neutron interferometer

Nano-machining for advanced X-ray crystal optics

Studies of the ductile mode of cutting brittle materials (A review)

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