Myceleal emphysematous cystitis complicating a renal transplant kidney

Lang, Erich K.; Rudman, Ernest; Zhang, Karl; Thorner, Daniel; Hanano, Amer

doi:10.1590/s1677-55382011000200014

Cited by 2 publications

(2 citation statements)

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“…聚酰亚胺薄膜的制备工艺条件，包括酰亚胺化方式、烘膜温度、升温速率、拉伸取向、薄膜厚度等均会对薄膜的热膨胀行为产生影响. 选择适宜的薄膜制备工艺条件，可促使聚酰亚胺分子链有序排列或紧密堆积，提高结晶或有序取向程度，限制链段或局部分子运动，从而改善薄膜的热膨胀性能 [63][64][65][66] . 国内外围绕薄膜制备工艺对面内线性热膨胀影响的研究很多，但对聚酰亚胺薄膜面外热膨胀特别是体积热膨胀的影响却鲜有报道.…”

Section: 薄膜制备工艺unclassified

Research progress in thermal expansion behavior of polyimide films

Wang¹,

Zhai²,

Gao³

et al. 2022

Sci. Sin.-Chim

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As one of the most important flexible substrates and interlayer dielectric materials, the thermal expansion performance of polyimide films has always attracted great interest. Especially with the development of advanced electronic and microelectronic devices, the linear and volumetric thermal expansion of polyimide films are facing more and more stringent requirements. In order to explore new generation polyimide films with low thermal expansion, it is necessary to clarify the thermal expansion behaviors and influence mechanism. For polymer films, the thermal expansion actually includes in-plane and out-of-plane linear as well as volumetric thermal expansion. Most researches on thermal expansion of polyimide films are focused on the in-plane thermal expansion, but there are few studies on the out-of-plane and volume thermal expansion of films. There is no systematic understanding of comprehensive and anisotropic of thermal expansion of films. The research on linear and volume thermal expansion behavior of polyimide films were firstly summarized in this paper. The testing methods were introduced in detail, including thermomechanical analysis (TMA), variable temperature wide-angle X-ray diffraction (VT-WAXD), capacitance technique, optical interferometry, etc. The influencing factors of thermal expansion behavior of polyimide films were discussed, such as molecular backbone structures, local molecular motions, chemical crosslinking, aggregation structures and film preparation process. The relationship between structures and processes on in-plane, out-of-plane linear and volumetric thermal expansion behavior of polyimide films was clarified. The problems and challenges in the future research on thermal expansion were prospected. This review can provide a necessary guidance for the development of high-performance polyimide films with low thermal expansion during wide temperature range.

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Section: 薄膜制备工艺unclassified

Research progress in thermal expansion behavior of polyimide films

Wang¹,

Zhai²,

Gao³

et al. 2022

Sci. Sin.-Chim

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show abstract

“…There has been a great deal of research conducted with the goal of reducing the CTE of PI films. 22 A straightforward method involves adding inorganic nanoparticles with low CTE, [23][24][25] although the filled polymer composites are usually optically hazy and lack sufficient strength. From the perspective of molecular structure design, increasing the length and rigidity of the main polymer chain or increasing inter-chain interactions would be desirable strategies.…”

Section: Introductionmentioning

confidence: 99%