Application of a Phase Field Model to Multicomponent Al-Cu-Si alloys

Abstract

The solidification of metals and alloys and the resulting microstructures, which as a function of thermal and solutal parameters can evolve as planar, cellular and dendritic, are important from a practical point of view, since they strongly influence the properties and quality of the final product. In many practical situations it is impracticable to develop analytical solutions permitting reliable predictions of microstructural growth during unsteady-state solidification conditions. The Phase Field method has become very popular and effective in modeling complex solid/liquid interfaces due to its ability to simulate the interface kinetics and the formation and evolution of different morphologies along the solidification process. In this work, a numerical analysis of the microstructural evolution during the transient solidification of dilute alloys of the Al-Cu-Si system is developed, which uses a phasefield approach for the simulation of ternary alloys. The phase-field, energy and solute concentration equations were numerically solved for the correspondent ternary system, varying the mesh parameters, temperature and alloy composition. The analysis performed were confronted with existing theoretical models and the results obtained are in agreement with the solidification theory.