2017
DOI: 10.1590/1980-5373-mr-2017-0054
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Study of Cryogenic Rolling of FCC Metals with Different Stacking Fault Energies

Abstract: Aluminum, copper and silver samples, all of them face-centered cubic (FCC) metals, were rolled at room and cryogenic temperatures until equivalent strains (ε) were between 3.23 and 4.13. The cryogenic temperature (CT) and room temperature (RT) rolled samples were evaluated by hardness tests and X-ray diffraction (XRD), which indicate influence of stacking fault energy (SFE) on process. Lower SFE metals tend to exhibit dislocation densities significantly increased and as consequence, hardness too. It was also n… Show more

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Cited by 17 publications
(5 citation statements)
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“…In the alloy performed by ECAP+CR (Figure 4c) condition, a structure of α-Mg grains was also observed with sizes from 0.5 to 2 μm, which was larger than the samples processed by ECAP+LTR. This feature can be understood by considering that the LTR processing may have promoted a significant increase in dislocation density accompanied by lower stacking fault energy due to dynamic recovery suppression at low temperature 25,47 , thus facilitating deformation 48 and, consequently, more intense grain refinement. Figure 5 shows bright field (BF) and dark field (DF) TEM images with Selected Area Electron Diffraction pattern (SAED) for the pure Mg and ZK60+2.5Mm alloy after ECAP+LTR.…”
Section: Resultsmentioning
confidence: 99%
“…In the alloy performed by ECAP+CR (Figure 4c) condition, a structure of α-Mg grains was also observed with sizes from 0.5 to 2 μm, which was larger than the samples processed by ECAP+LTR. This feature can be understood by considering that the LTR processing may have promoted a significant increase in dislocation density accompanied by lower stacking fault energy due to dynamic recovery suppression at low temperature 25,47 , thus facilitating deformation 48 and, consequently, more intense grain refinement. Figure 5 shows bright field (BF) and dark field (DF) TEM images with Selected Area Electron Diffraction pattern (SAED) for the pure Mg and ZK60+2.5Mm alloy after ECAP+LTR.…”
Section: Resultsmentioning
confidence: 99%
“…Self-annealing phenomena depend not only on material properties, such as pure metals/alloys or low/high melting point, but also on strain, strain rate, stacking fault energy, and deformation temperature [1]. Self-annealing can also decrease the micro-hardness values, which were reported for CR FCC materials [4,6].…”
Section: Introductionmentioning
confidence: 85%
“…The ways to maintain low homologous temperature during SPD processing are (i) processing at low temperatures (e.g., cryogenic rolling at liquid nitrogen temperature) and (ii) processing materials with high melting points [18]. The maximum dislocation density in an SPD-processed material has a strong dependence on the SFE [90][91] and the melting temperature. The thermally activated (cross-slip and climb) processes of dislocation annihilation can explain the dependence of saturation dislocation density on the melting point of the processed materials.…”
Section: Microstructural and Mechanical Properties Of Hpt-processed M...mentioning
confidence: 99%