“…Nitrogen-implanted floating guard rings (FGRs), which have demonstrated effectiveness as an edge-termination technology for kV-class vertical GaN PIN rectifiers, can be used to improve the avalanche breakdown voltage and prevent device failure due to premature breakdown by creating a smooth electric potential and gradient electric field distribution along the junction interface as demonstrated in our previous study. 4,5 Besides the effects of the device edge-termination technique, material defects could also be a detrimental factor in device performance. Surface roughness can cause the incorporation of carbon-related defects and create a more insulating surface region than the bulk.…”
Section: Breakdown Characteristics Analysis Of Kv-class Vertical Gan ...mentioning
confidence: 99%
“…Details of the device fabrication process and electrical performance were reported in our previous study. 5 To analyze the impact of wafer quality on PIN rectifier breakdown characteristics, confocal PL microscopic mapping was performed at a sub-bandgap excitation wavelength of 405 nm (∼3.06 eV) in device locations prior to the individual PIN device fabrication. An illustration of the PL measurement setup is shown in Fig.…”
Section: Device Fabrication and Sub-bandgap Pl Characterizationmentioning
confidence: 99%
“…devices had 100 V higher averaged BV, indicating that the BV could be related to the number of defects within the device region. 18,19 The BV histograms of measured PIN rectifier devices on wafers A and B are shown in Fig. 3.…”
Section: Premature Breakdown and Correlation With Materials Defectsmentioning
confidence: 99%
“…22,23 It has been reported that the existence of YL in all MOCVD-grown layers could be related to carbon impurities such as C N in n-GaN and undoped GaN 24 and nitrogen vacancy (V N ) in p-GaN:Mg. 25 In particular, the latter exhibits a PL band with a maximum near 2.33 eV or green luminescence (GL). 22 From the temperature-dependent J-V measurements and fitting for the Poole-Frenkel model reported in the previous study, 5 a trap state with an energy level of 0.53 ± 0.05 eV was extracted and can be related to V N . Nevertheless, V N is not observed under PL in n-GaN due to its neutral charge state and it is also hard to observe in p-GaN due to its 3+ state.…”
Section: Premature Breakdown and Correlation With Materials Defectsmentioning
This work reports analysis of the reverse-bias breakdown characteristics of homojunction gallium nitride (GaN) p–i–n (PIN) rectifiers fabricated on bulk GaN substrates. Sub-bandgap photoluminescence mapping at room temperature as a contactless, non-destructive wafer inspection method was performed to analyze the impact of material properties on grown GaN PIN diodes and to study the correlation between defect types and breakdown characteristics of vertical GaN PIN rectifiers. Under the sub-bandgap excitation, yellow luminescence is dominant. The premature breakdown characteristics of the fabricated kV-class vertical GaN PIN rectifiers with nitrogen-implanted floating guard rings are found to be associated with material defects and deep level complexes. Photoluminescence mapping has demonstrated its effectiveness in quantitative analysis of dislocations and other types of defects.
“…Nitrogen-implanted floating guard rings (FGRs), which have demonstrated effectiveness as an edge-termination technology for kV-class vertical GaN PIN rectifiers, can be used to improve the avalanche breakdown voltage and prevent device failure due to premature breakdown by creating a smooth electric potential and gradient electric field distribution along the junction interface as demonstrated in our previous study. 4,5 Besides the effects of the device edge-termination technique, material defects could also be a detrimental factor in device performance. Surface roughness can cause the incorporation of carbon-related defects and create a more insulating surface region than the bulk.…”
Section: Breakdown Characteristics Analysis Of Kv-class Vertical Gan ...mentioning
confidence: 99%
“…Details of the device fabrication process and electrical performance were reported in our previous study. 5 To analyze the impact of wafer quality on PIN rectifier breakdown characteristics, confocal PL microscopic mapping was performed at a sub-bandgap excitation wavelength of 405 nm (∼3.06 eV) in device locations prior to the individual PIN device fabrication. An illustration of the PL measurement setup is shown in Fig.…”
Section: Device Fabrication and Sub-bandgap Pl Characterizationmentioning
confidence: 99%
“…devices had 100 V higher averaged BV, indicating that the BV could be related to the number of defects within the device region. 18,19 The BV histograms of measured PIN rectifier devices on wafers A and B are shown in Fig. 3.…”
Section: Premature Breakdown and Correlation With Materials Defectsmentioning
confidence: 99%
“…22,23 It has been reported that the existence of YL in all MOCVD-grown layers could be related to carbon impurities such as C N in n-GaN and undoped GaN 24 and nitrogen vacancy (V N ) in p-GaN:Mg. 25 In particular, the latter exhibits a PL band with a maximum near 2.33 eV or green luminescence (GL). 22 From the temperature-dependent J-V measurements and fitting for the Poole-Frenkel model reported in the previous study, 5 a trap state with an energy level of 0.53 ± 0.05 eV was extracted and can be related to V N . Nevertheless, V N is not observed under PL in n-GaN due to its neutral charge state and it is also hard to observe in p-GaN due to its 3+ state.…”
Section: Premature Breakdown and Correlation With Materials Defectsmentioning
This work reports analysis of the reverse-bias breakdown characteristics of homojunction gallium nitride (GaN) p–i–n (PIN) rectifiers fabricated on bulk GaN substrates. Sub-bandgap photoluminescence mapping at room temperature as a contactless, non-destructive wafer inspection method was performed to analyze the impact of material properties on grown GaN PIN diodes and to study the correlation between defect types and breakdown characteristics of vertical GaN PIN rectifiers. Under the sub-bandgap excitation, yellow luminescence is dominant. The premature breakdown characteristics of the fabricated kV-class vertical GaN PIN rectifiers with nitrogen-implanted floating guard rings are found to be associated with material defects and deep level complexes. Photoluminescence mapping has demonstrated its effectiveness in quantitative analysis of dislocations and other types of defects.
scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.