01005 SMT component assembly for wireless SIP modules

PurposeThe purpose of this paper is to optimize assembly processes in order to minimize defects in the assembly of 01005 chip components.Design/methodology/approachDuring the study, solder paste printing process‐related variables, such as solder paste type, stencil type, and stencil opening ratio, and pick and place process‐related methods, such as vision camera type and vacuum pickup nozzle type were evaluated with the goal of achieving a high‐yield assembly solution for 01005 chip components. A test board was used in a series of designed experiments to optimize the solder paste printing, pick and placement, and reflow processes. Assembly defects were analyzed as a function of the stencil design and the assembly processes.FindingsThe results of the study indicated that both electroformed and electropolished laser‐cut stencils had a comparable print quality with respect to the solder volume delivered to the pads. In terms of assembly yield performance, type 4 (size range: 20‐38 μm) solder paste with a smaller sphere size gave a better overall yield and better paste deposition on the pad, if used on a 0.08‐mm thick electroformed stencil with a 90 per cent aperture. Temperature cycling between −65 and 150°C, with up to 1,500 cycles, showed that no cracks were observed at the solder joints due to temperature cycling. The process and design change required for achieving a robust manufacturing process have been indicated and reported.Originality/valueThe results of this work provide process recommendations for the implementation of 01005‐sized chip components assembly in mass production processes.

Section: Resultssupporting

confidence: 92%

Process characterization and reliability for the assembly of 01005 chip components

Lee¹,

Kim

Suganuma

2011

“…From Figure 7, only the stencil thickness had an obvious effect on volume transfer efficiency. The stencil with 76 μ m thickness has a better transfer efficiency (more than 95 percent) than the stencil with 102 μ m thickness (72 percent), which correlates with area ratio, since the area ratio has been shown to have the biggest impact on transfer efficiency and repeatability of the solder paste deposits (Jarvina et al , 2005). The 76 μ m thick stencil with a pad size 5 has a higher area ratio (0.903) than the 102 μ m thick stencil (0.677).…”

Section: Printing Optimizationmentioning

confidence: 99%

“…However, the use of such a tiny component poses challenges for SMT assembly. The main factors affecting the 01005 assembly process can be divided into the following categories: PCB design, components, stencil, solder paste, PCB handling, printing, pick and placement, reflow and inspection (Mattsson et al , 2004: Jarvina et al , 2005).…”

Section: Introductionmentioning

confidence: 99%

Optimization of lead free solder 01005 component assembly

Liu

Johnson

2007

If you would like to write for this, or any other Emerald publication, then please use our Emerald for Authors service information about how to choose which publication to write for and submission guidelines are available for all. Please visit www.emeraldinsight.com/authors for more information. About Emerald www.emeraldinsight.comEmerald is a global publisher linking research and practice to the benefit of society. The company manages a portfolio of more than 290 journals and over 2,350 books and book series volumes, as well as providing an extensive range of online products and additional customer resources and services.Emerald is both COUNTER 4 and TRANSFER compliant. The organization is a partner of the Committee on Publication Ethics (COPE) and also works with Portico and the LOCKSS initiative for digital archive preservation. AbstractPurpose -To optimize the printed circuit board design and assembly processes to minimize defects in the assembly of 01005 size chip resistors. Design/methodology/approach -A test board was designed with a range of pad sizes, pad shapes, pad spacings and pad orientations. This test board was used in a series of designed experiments to optimize the printing, placement and reflow processes. Assembly defects were analyzed as a function of board design and assembly processes. Findings -An electroformed, 76 mm stencil yielded a robust paste printing process and higher process capability indices (C p ) compared to a 102 mm stencil. Nitrogen reflow was required to achieve good solder wetting due to the high surface-to-volume ratio of the solder deposits. With regard to bridging defects, no defects were observed if the pad-to-pad spacing for parallel resistors was 150 mm or larger. Rectangular pads with no vias-in-pad and designed at 90 percent of nominal pad size (pad size type 2) with the ramp profile, independent of 08 or 908 resistor orientation yielded the lowest number of defects. Given the undersized pads on the actual board, the 90 percent pad average width was 170 mm (versus a design value of 183 mm) and the measured width of the 01005 chip resistor was 180 mm. Thermal cycle reliability testing of the solder joints with this pad size showed no failures after 1,000 thermal cycles. Originality/value -The results of this work provide a set of design and assembly processes recommendations for those who must implement 01005 size component assembly in production.

“…Reducing both the size of the passive components and the spacing between them increases the package density, and this is an efficient way to miniaturize many electronic products. The industry has witnessed the introduction of a variety of chip sizes, including 0402 (1,005 metric, 1.0 mm £ 0.5 mm), 0201 (0603 metric, 0.6 mm £ 0.3 mm), and 01005 (0402 metric, 0.4 mm £ 0.2 mm) (Jarvina et al, 2005).…”

Section: Introductionmentioning

confidence: 99%

“…However, the use of such tiny components poses great challenges for surface-mounttechnology (SMT) assembly. The main factors affecting the 01005 assembly process can be divided into the following categories: printed-circuit-board (PCB) design (Liu and Johnson, 2007), stencil design (Li et al, 2009), solder paste (Lee et al, 2011a, b), pick and place (Jarvina et al, 2005), reflow and inspection (Bhalerao, 2004).…”

Section: Introductionmentioning

confidence: 99%

The behaviour of solder pastes in stencil printing with electropolishing process

Lee

Kim

Suganuma

2013

PurposeThe purpose of this paper is to study the effect of the electropolishing time of stencil manufacturing parameters and solder‐mask definition methods of PCB pad design parameters on the performance of solder paste stencil printing process for the assembly of 01005 chip components.Design/methodology/approachDuring the study, two types of stencils were manufactured for the evaluations: electroformed stencils and electropolished laser‐cut stencils. The electroformed stencils were manufactured using the standard electroforming process and their use in the paste printing process was compared against the use of an electropolished laser‐cut stencil. The electropolishing performance of the laser‐cut stencil was evaluated twice at the following intervals: 100 s and 200 s. The performance of the laser‐cut stencil was also evaluated without electropolishing. An optimized process was established after the polished stencil apertures of the laser‐cut stencil were inspected. The performance evaluations were made by visually inspecting the quality of the post‐surface finishing for the aperture wall and the quality of that post‐surface finishing was further checked using a scanning electron microscope. A test board was used in a series of designed experiments to evaluate the solder paste printing process.FindingsThe results demonstrated that the length of the electropolishing time had a significant effect on the small stencil's aperture quality and the solder paste's stencil printing performance. In this study, the most effective electropolishing time was 100 s for a stencil thickness of 0.08 mm. The deposited solder paste thickness was significantly better for the enhanced laser‐cut stencil with electropolishing compared to the conventional electroformed stencils. In this printing‐focused work, print paste thickness measurements were also found to vary across different solder‐mask definition methods of printed circuit board pad designs with no change in the size of the stencil aperture. The highest paste value transfer consistently occurred with solder‐mask‐defined pads, when an electropolished laser‐cut stencil was used.Originality/valueDue to important improvements in the quality of the electropolished laser‐cut stencil, and based on the results of this experiment, the electropolished laser‐cut stencil is strongly recommended for the solder paste printing of fine‐pitch and miniature components, especially in comparison to the typical laser‐cut stencil. The advantages of implementing a 01005 chip component mass production assembly process include excellent solder paste release, increased solder volume, good manufacture‐ability, fast turnaround time, and greater cost saving opportunities.