The process of acquiring the energy surrounding a system and converting it into usable electrical energy is termed power harvesting. In the last few years, the field of power harvesting has experienced significant growth due to the ever increasing desire to produce portable and wireless electronics with extended life. Current portable and wireless devices must be designed to include electrochemical batteries as the power source. The use of batteries can be troublesome due to their finite energy supply, which necessitates their periodic replacement. In the case of wireless sensors that are to be placed in remote locations, the sensor must be easily accessible or of disposable nature to allow the device to function over extended periods of time. Energy scavenging devices are designed to capture the ambient energy surrounding the electronics and covert it into usable electrical energy. The concept of power harvesting works towards developing self-powered devices that do not require replaceable power supplies. The development of energy harvesting systems is greatly facilitated by an accurate model to assist in the design of the system. This paper will describe a theoretical model of a piezoelectric based energy harvesting system that is simple to apply yet provides an accurate prediction of the power generated around a single mode of vibration. Furthermore, this model will allow optimization of system parameters to be studied such that maximal performance can be achieved. Using this model an expression for the optimal resistance and a parameter describing the energy harvesting efficiency will be presented and evaluated through numerical simulations.The second part of this paper will present an experimental validation of the model and optimal parameters.

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This paper performs an analysis of maximum power output of piezoelectric energy harvesters. It has been observed that there exists an overall power limit that can be obtained by tuning energy harvesting circuits, including both linear and nonlinear. The significance of the power limit is that it represents the maximum possible power output or capacity of an energy harvester. In other words, the harvested power is always capped by this limit regardless of the type and tuning of the energy harvesting circuit interface. The power limit and the optimal generalized electrical load or impedance to reach this power limit are first obtained directly by using the electromechanically coupled equations of the system, and then obtained by using the equivalent circuit analysis and impedance matching approach. Both are commonly used methods in energy harvesting research. This paper presents an effort to unify them but also offer insights on the power limit from two different perspectives. In the second part of this paper, the power limit and impedance matching results are applied to a linear energy harvesting circuit interface, i.e., resistive energy harvesting (REH) circuit, and a nonlinear circuit interface, i.e., standard AC–DC energy harvesting (SEH) circuit, to study their physical constraints on the impedance matching and clearly explain their power behaviors such as the maximum power and the effect of electromechanical coupling on the power. In addition, closed-form expressions, a relationship between the mechanical damping and the effective electromechanical coupling coefficient, to define the three types of coupling, i.e., weak, critical, strong, are obtained. It is found that the SEH harvesters require about 1.5 times of minimum electromechanical coupling of that of REH harvesters to reach the power limit, and the frequency bandwidth between the two power limit frequencies of a SEH harvester is narrower than that of a REH harvester given the same level of strong electromechanical coupling.

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Health monitoring of structures and people requires the integration of sensors and devices on various 3D curvilinear, hierarchically structured, and even dynamically changing surfaces. Therefore, it is highly desirable to explore conformal manufacturing techniques to fabricate and integrate soft deformable devices on complex 3D curvilinear surfaces. Although planar fabrication methods are not directly suitable to manufacture conformal devices on 3D curvilinear surfaces, they can be combined with stretchable structures and the use of transfer printing or assembly methods to enable the device integration on 3D surfaces. Combined with functional nanomaterials, various direct printing and writing methods have also been developed to fabricate conformal electronics on curved surfaces with intimate contact even over a large area. After a brief summary of the recent advancement of the recent conformal manufacturing techniques, we also discuss the challenges and potential opportunities for future development in this burgeoning field of conformal electronics on complex 3D surfaces.