The effect of Bi (semimetal) nanoinclusions in nanostructured Bi2Te3 matrices is investigated. Bismuth nanoparticles synthesized by a low temperature solvothermal method are incorporated into Bi2Te3 matrix phases, synthesized by planetary ball milling. High density pellets of the Bi nanoparticle/Bi2Te3 nanocomposites are created by hot pressing the powders at 200 °C and 100 MPa. The effect of different volume fractions (0–7%) of Bi semimetal nanoparticles on the Seebeck coefficient, electrical conductivity, thermal conductivity and carrier concentration is reported. Our results show that the incorporation of semimetal nanoparticles results in a reduction in the lattice thermal conductivity in all the samples. A significant enhancement in power factor is observed for Bi nanoparticle volume fraction of 5% and 7%. We show that it is possible to reduce the lattice thermal conductivity and increase the power factor resulting in an increase in figure of merit by a factor of 2 (from ZT = 0.2 to 0.4). Seebeck coefficient and electrical conductivity as a function of carrier concentration data are consistent with the electron filtering effect, where low‐energy electrons are preferentially scattered by the barrier potentials set up at the semimetal nanoparticle/semiconductor interfaces.
The topologically protected surface states of three-dimensional (3D) topological insulators have the potential to be transformative for high-performance logic and memory devices by exploiting their specific properties such as spin-polarized current transport and defect tolerance due to suppressed backscattering. However, topological insulator based devices have been underwhelming to date primarily due to the presence of parasitic issues. An important example is the challenge of suppressing bulk conduction in BiSe and achieving Fermi levels ( E) that reside in between the bulk valence and conduction bands so that the topologically protected surface states dominate the transport. The overwhelming majority of the BiSe studies in the literature report strongly n-type materials with E in the bulk conduction band due to the presence of a high concentration of selenium vacancies. In contrast, here we report the growth of near-intrinsic BiSe with a minimal Se vacancy concentration providing a Fermi level near midgap with no extrinsic counter-doping required. We also demonstrate the crucial ability to tune E from below midgap into the upper half of the gap near the conduction band edge by controlling the Se vacancy concentration using post-growth anneals. Additionally, we demonstrate the ability to maintain this Fermi level control following the careful, low-temperature removal of a protective Se cap, which allows samples to be transported in air for device fabrication. Thus, we provide detailed guidance for E control that will finally enable researchers to fabricate high-performance devices that take advantage of transport through the topologically protected surface states of BiSe.
Ballistic electron emission microscopy has been utilized to demonstrate differences in the interface electrostatics of tungsten-Si(001) Schottky diodes fabricated using two different deposition techniques: thermal evaporation using electron-beam heating and magnetron sputtering. A difference of 70 meV in the Schottky barrier heights is measured between the two techniques for both p- and n-type silicon even though the sum of n- and p-type Schottky barrier heights agrees with the band gap of silicon. Spatially resolved nanoscale maps of the Schottky barrier heights are uniform for the sputter film and are highly disordered for the e-beam film. Histograms of the barrier heights show a symmetric Gaussian like profile for the sputter film and a skewed lognormal distribution for e-beam film. A Monte-Carlo model is developed to simulate these histograms which give strong indication that localized elastic scattering is causing this skewing as forces the hot electrons to need a greater total energy to surmount the barrier. These differences are attributed to silicide formation from the unintentional substrate heating during the e-beam deposition, which is confirmed with transmission electron microscopy.
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