We report temperature-dependent time-integrated and time-resolved photoluminescence (PL) studies of InGaN/GaN multiple quantum wells (MQWs) grown by metalorganic chemical vapor deposition. We observed anomalous emission behavior, specifically an S-shaped (decrease–increase–decrease) temperature dependence of the peak energy (Ep) for InGaN-related PL with increasing temperature: Ep redshifts in the temperature range of 10–70 K, blueshifts for 70–150 K, and redshifts again for 150–300 K with increasing temperature. In addition, when Ep redshifts, the spectral width is observed to narrow, while when Ep blueshifts, it broadens. From a study of the integrated PL intensity as a function of temperature, it is found that thermionic emission of photocarriers out of local potential minima into higher energy states within the wells is the dominant mechanism leading to the thermal quenching of the InGaN-related PL. We demonstrate that the temperature-induced S-shaped PL shift is caused by a change in the carrier dynamics with increasing temperature due to inhomogeneity and carrier localization in the InGaN/GaN MQWs.
We report on the use of in-situ SiNx nanomask for defect reduction in nonpolar a-plane GaN films, grown by metal-organic chemical vapor deposition. High-resolution x-ray diffraction analysis revealed that there was a monotonic reduction in the full width at half maximum, both on-axis and off-axis, with the increase in the SiNx thickness. Atomic force microscopy images revealed a significant decrease in the root-mean-square roughness and the density of submicron pits. Cross-section and plan-view transmission electron microscopy on the samples showed that the stacking fault density decreased from 8×105to3×105cm−1 and threading dislocation density decreased from 8×1010to9×109cm−2. Room temperature photoluminescence measurement revealed that the band-edge emission intensity increased with the insertion of the SiNx layer, which suggests reduction in the nonradiative recombination centers.
Growth conditions for AlN in two dimensional (2D) and three dimensional (3D) growth modes were explored on SiC using metal organic chemical vapor deposition. High quality AlN layers were obtained by alternating between 3D and 2D growth modes, referred to as modulation growth (MG). Long parallel atomic terraces without step terminations were observed in atomic force microscopy (AFM) scans of MG AlN, indicating a reduced dislocation density. X-ray diffraction rocking curves yielded full widths at half maximum (FWHM) of 86 and 363arcsec for the (002) and (102) reflections, respectively, giving further evidence of low dislocation density in the film. 3D-2D MG also releases some of the tensile strain in the AlN film, enabling the growth of thick, crack-free AlN on SiC substrates.
Articles you may be interested inOptical study of a -plane InGaN/GaN multiple quantum wells with different well widths grown by metal-organic chemical vapor deposition J. Appl. Phys.
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