This article presents the application of a parallel dispensing device for low‐temperature silver paste metallization on transparent conductive oxide (TCO) layers of Cu(In1 − xGax)Se2 (CIGS) substrates as an alternative metallization technology to screen printing and inkjet printing. A curing variation experiment is performed to analyze the effect of different curing conditions on the resulting contact resistivity of the metal grid. Contact resistivity values below 5 mΩcm2 are achieved. Furthermore, CIGS mini‐modules are metallized with three different low‐temperature paste formulations obtaining a record core finger geometry of 25 μm and an average optical aspect ratio of 0.46 using 25 μm nozzle openings. The dispensed metal grid on the TCO layers achieves the comparable current density values of jsc = 32.2 mA cm−2 and the open‐circuit voltages values per cell of Voc = 672 mV as the screen printed metal grid on CIGS mini‐modules and, hence, a nominal power of 2.05 W. The metal grid enables the use of broader cell widths compared with grid‐free CIGS samples and results in a reduced dead area.
We report recent achievements in adapting industrially used solar cell processes on nanotextured surfaces. Nanostructures were etched into c-Si surfaces by dry exothermic plasma-less reaction of F species with Si in atmospheric pressure conditions and then modified using a short post-etching process. Nanotextured multicrystalline wafers are used to prepare Al-BSF solar cells using industrially feasible solar cell processing steps. In comparison to the reference acidic textured solar cells, the nanostructured cells showed gain in short circuit current (Jsc) of up to 0.8 mA/cm2 and absolute gain in conversion efficiency of up to 0.3%. The best nanotextured solar cell was independently certified to reach the conversion efficiency of 18.0
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