Developing advanced thermal interface materials (TIMs) to bridge heat-generating chip and heat sink for constructing an efficient heat transfer interface is the key technology to solve the thermal management issue of high-power semiconductor devices. Based on the ultra-high basal-plane thermal conductivity, graphene is an ideal candidate for preparing high-performance TIMs, preferably to form a vertically aligned structure so that the basal-plane of graphene is consistent with the heat transfer direction of TIM. However, the actual interfacial heat transfer efficiency of currently reported vertically aligned graphene TIMs is far from satisfactory. In addition to the fact that the thermal conductivity of the vertically aligned TIMs can be further improved, another critical factor is the limited actual contact area leading to relatively high contact thermal resistance (20–30 K mm2 W−1) of the “solid–solid” mating interface formed by the vertical graphene and the rough chip/heat sink. To solve this common problem faced by vertically aligned graphene, in this work, we combined mechanical orientation and surface modification strategy to construct a three-tiered TIM composed of mainly vertically aligned graphene in the middle and micrometer-thick liquid metal as a cap layer on upper and lower surfaces. Based on rational graphene orientation regulation in the middle tier, the resultant graphene-based TIM exhibited an ultra-high thermal conductivity of 176 W m−1 K−1. Additionally, we demonstrated that the liquid metal cap layer in contact with the chip/heat sink forms a “liquid–solid” mating interface, significantly increasing the effective heat transfer area and giving a low contact thermal conductivity of 4–6 K mm2 W−1 under packaging conditions. This finding provides valuable guidance for the design of high-performance TIMs based on two-dimensional materials and improves the possibility of their practical application in electronic thermal management.
Strain and temperature are important physiological parameters for health monitoring, providing access to the respiration state, movement of joints, and inflammation processes. The challenge for smart wearables is to unambiguously discriminate strain and temperature using a single sensor element assuring a high degree of sensor integration. Here, a dual-mode sensor with two electrodes and tubular mechanically heterogeneous structure enabling simultaneous sensing of strain and temperature without cross-talk is reported. The sensor structure consists of a thermocouple coiled around an elastic strain-to-magnetic induction conversion unit, revealing a giant magnetoelastic effect, and accommodating a magnetic amorphous wire. The thermocouple provides access to temperature and its coil structure allows to measure impedance changes caused by the applied strain. The dual-mode sensor also exhibits interference-free temperature sensing performance with high coefficient of 54.49 µV °C−1 , low strain and temperature detection limits of 0.05% and 0.1 °C, respectively. The use of these sensors in smart textiles to monitor continuously breathing, body movement, body temperature, and ambient temperature is demonstrated. The developed multifunctional wearable sensor is needed for applications in early disease prevention, health monitoring, and interactive electronics as well as for smart prosthetics and intelligent soft robotics.
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