A freestanding GaN substrate over 2 inches in size was successfully prepared for the first time by hydride vapor phase epitaxy (HVPE) using GaAs as a starting substrate. In the experiment, a GaAs (111)A substrate with a SiO 2 mask pattern on its surface was used. A thick GaN layer was grown on the GaAs substrate at 1030 • C through the openings in the SiO 2 mask. By dissolving the GaAs substrate in aqua regia, a freestanding GaN substrate about 500 µm thick was obtained. The fullwidth at half maximum (FWHM) in the ω-mode X-ray diffraction (XRD) profile of GaN (0002) plane was 106 arcsec. The dislocation density of the GaN substrate obtained was determined to be as low as 2 × 10 5 cm −2 by plan-view transmission electron microscopy (TEM). Hall measurements revealed the n-type conductivity of the GaN substrate with typical carrier concentration and carrier mobility of 5 × 10 18 cm −3 and 170 cm 2 ·V −1 ·s −1 , respectively.

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AlN single crystal is one of the promising materials for substrates of GaN-based laser diodes. We prepared aluminum nitride single crystals by the sublimation method and characterized them. The crystals are transparent and slightly yellow. Some crystals are needle-shaped with a hexagonal cross section, diameter of 0.5 mm and length of 3 mm, grown parallel to |001|. Other crystals are plate-shaped with a maximum width of 3 mm, 5 mm length and 0.5 mm thickness, grown with a large (001) face. Also, other crystals are needle-shaped with a rectangular cross section, width of 1 mm, 7 mm length and 0.3 mm thickness, grown with a large (101) face. Their widths of X-ray rocking curves is about 39 arcsec, with a full width at half-maximum, 203 arcsec and 12 arcsec, respectively. The orientation of AlN single crystal axis is sufficient for use in substrates for GaN-based diodes.

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