We present the development of an array type of micromachined Mirau interferometers, operating in the regime of low coherence interferometry (LCI) and adapted for massively parallel inspection of MEMS. The system is a combination of free-space micro-optical technologies and silicon micromachining, based on the vertical assembly of two glass wafers. The probing wafer carries an array of refractive microlenses, diffractive gratings to correct chromatic and spherical aberrations and reference micro-mirrors. The semitransparent beam splitter plate is based on the deposition of a dielectric multilayer, sandwiched between two glass wafers. The interferometer matrix is the key element of a novel inspection system aimed to perform parallel inspection of MEMS. The fabricated demonstrator, including 5 × 5 channels, allows consequently decreasing the measurement time by a factor of 25. In the following, the details of fabrication processes of the micro-optical components and their assembly are described. The feasibility of the LCI is demonstrated for the measurement of a wafer of MEMS sensors.
We report on results obtained with an aspherical mirror to compensate for the phase front aberrations of a cw thin-disk laser with a single disk in the resonator. A record output power of 5 kW with a beam quality suitable for laser cutting (beam propagation factor M2=9.2) has been achieved.
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