Second sound is known as the thermal transport regime where heat is carried by temperature waves. Its experimental observation was previously restricted to a small number of materials, usually in rather narrow temperature windows. We show that it is possible to overcome these limitations by driving the system with a rapidly varying temperature field. High-frequency second sound is demonstrated in bulk natural Ge between 7 K and room temperature by studying the phase lag of the thermal response under a harmonic high-frequency external thermal excitation and addressing the relaxation time and the propagation velocity of the heat waves. These results provide a route to investigate the potential of wave-like heat transport in almost any material, opening opportunities to control heat through its oscillatory nature.

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The hydrodynamic heat transport equation with appropriate boundary conditions and ab initio calculated coefficients is validated by comparing the corresponding analytical and numerical solutions with frequencydomain thermoreflectance experimental measurements in silicon. Special attention is devoted to identifying the resistive effects appearing at the interface between the metal transducer and the silicon substrate. We find that a Fourier model using frequency-dependent effective thermal conductivity cannot simultaneously explain the experimental phase shifts and the amplitude of the temperature oscillations, whereas the hydrodynamic model using intrinsic parameters provides good agreement across a wide temperature range. In addition, phenomenology appearing at reduced length and time scales in this kind of experiment at different temperatures is shown. Specifically, we find hydrodynamic modes of thermal transport that are analogous to pressure-and shear-wave propagation in viscoelastic media.

Heat management is crucial in the design of nanoscale devices as the operating temperature determines their efficiency and lifetime. Past experimental and theoretical works exploring nanoscale heat transport in semiconductors addressed known deviations from Fourier's law modeling by including effective parameters, such as a size-dependent thermal conductivity. However, recent experiments have qualitatively shown behavior that cannot be modeled in this way. Here, we combine advanced experiment and theory to show that the cooling of 1D-and 2D-confined nanoscale hot spots on silicon can be described using a general hydrodynamic heat transport model, contrary to previous understanding of heat flow in bulk silicon. We use a comprehensive set of extreme ultraviolet scatterometry measurements of nondiffusive transport from transiently heated nanolines and nanodots to validate and generalize our ab initio model, that does not need any geometrydependent fitting parameters. This allows us to uncover the existence of two distinct time scales and heat transport mechanisms: an interface resistance regime that dominates on short time scales and a hydrodynamic-like phonon transport regime that dominates on longer time scales. Moreover, our model can predict the full thermomechanical response on nanometer length scales and picosecond time scales for arbitrary geometries, providing an advanced practical tool for thermal management of nanoscale technologies. Furthermore, we derive analytical expressions for the transport time scales, valid for a subset of geometries, supplying a route for optimizing heat dissipation.