As a promising candidate to replace the brittle and expensive transparent indium tin oxide (ITO) conductor, the use of silver nanowire (AgNW) networks still involves issues such as high-temperature post-treatments and poor substrate adhesion for industrial application. Here a room-temperature soldering and one-step solution method is developed to achieve high-performance Ag nanowire transparent conductive films (TCFs). A nonconductive binder is prepared from poly(dopamine) and alginic acid which contains abundant catechol and carboxylic acid functional groups. The drying of the binder on the Ag nanowire percolation networks induces tighter contact among the nanowires and strong adhesion to the substrate, simultaneously enhancing the electrical and mechanical properties without a high-temperature annealing process. As a result, a highly conductive and bendable AgNW film is demonstrated on a low-cost polyethylene glycol terephthalate (PET) substrate, showing an 89% optical transmittance at λ = 550 nm and a sheet resistance of 16.3 Ohm sq(-1). Its optical and electrical performances are superior to those obtained from the reported indium tin oxide (ITO) films. Moreover, the AgNW film exhibits strong adhesion to the substrate, maintaining its conductivity after 100 tape tests, and it still resists the tape test even after exposure to solvent for several hours. Most importantly, the film shows good reliability during long-term 85 °C/85% RH (relative humidity) aging, which has been rarely investigated although it is a critical requirement for industrial application. The advanced and wide-ranging features of the prepared AgNW film greatly contribute to its use as a transparent electrode in multifunctional flexible electronic devices.

Silver nanowire (AgNW) networks are a promising candidate to replace indium tin oxide (ITO) as transparent conductors. In this paper, a novel transparent composite conductor composed of AgNW/biocompatible alginate gel on a flexible polyethylene terephthalate (PET) substrate, with synchronously enhanced adhesion and reduced resistivity, is prepared without high‐temperature annealing. The sheet resistance of the flexible AgNW/PET film reduces from 300 to 50.3 Ohm sq−1 at transmittance of 94%. The optical and electrical performance is superior to that obtained from the flexible ITO film on PET. Meanwhile, the sheet resistance does not show great change after tape test, suggesting a good adhesion of AgNW to the polymer substrate. Moreover, the AgNW composite film shows a good stability to resist long‐term storage, solvent damage, and ultrasonication. Finally, polymer solar cells employing the composite AgNW film as the electrode are realized, displaying an efficiency of 2.44%.

Low dielectric polymers play an important role in replacing traditional inorganic dielectric materials in advanced electronic manufacturing due to their excellent physical and chemical properties. Herein we report the preparation and characterization of two novel low-k dielectric polymers by introducing adamantane into benzocyclobutene. Because the adamantyl group has low polarizability and can increase the free volume of the polymer, both polymers showed low dielectric constants (2.5) and low dielectric loss (o0.001) at the frequency within 10 KHz-5 MHz. They also showed excellent film uniformity and planarity with the surface roughness less than 0.6 nm and good hydrophobicity with the contact angle larger than 1071. Due to the high cross-linked network structure, both of the adamantylbased BCB polymers exhibited high glass transition temperature (4350 1C), high storage modulus and good thermal stability (T d 4 400 1C in nitrogen). Especially, the p-Ada-TVS-BCB polymer showed a low coefficient of thermal expansion (41 mm m À1 1C À1 ). All of these good properties are in accord with the requirement of the interconnect fabrication of Cu metallization using the damascene process. Both of the polymers are suitable for the utilization in the electronic packing industry.

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An unprecedented electrostatic self-assembly of MXene and SiO 2 on carbon fiber (CF) to enhance the interfacial properties of CF-reinforced epoxy resin composites is disclosed. MXene with negative charge was anchored on the cationized CF surface via a strong electrostatic interaction, followed by synergistic effect of amine-modified SiO 2 (positive charge) to furnish a stable MXene/SiO 2 material with three-dimensional structure, which takes the advantages of high modulus, large specific surface area, and high-surface activity. The involvement of the two nano-materials with different dimensions and morphologies results in synergistic enhancement on mechanical interlocking, leading to excellent chemical bonding connection between CF and resin, which could transfer stress and dissipate energy effectively. Moreover, the surface energy of CF increased from 26.67 to 48.12 mJ/m 2 after assembly of MXene/SiO 2 . Compared with unsized CF/EP composites, the interfacial shear strength, interlaminar shear strength, and flexural strength of CF/MXene/SiO 2 /epoxy (EP) composites were increased by 73.2%, 61.2%, and 39.2%, respectively. Dynamic mechanical analysis poxy (DMA) tests showed that the storage modulus of the CF/MXene/SiO 2 /EP composites was enhanced by 64% compared with CF/EP composites, and the glass-transition temperature of composites was elevated from 147.9 to 151.8 C. This protocol provides a promising strategy for designing advanced CF/EP composites with threedimensional structure.