No abstract

No abstract

Die Kinetik und der Mechanismus der Kathoden‐ und Anodenprozesse an Cu‐ Elektroden in wäßriger KOH‐Lösung werden voltammetrisch untersucht.

The tribo‐ellipsometric technique allows one to distinguish between film growth and other reactions that occur after removal of a film from a metal surface in a given environment. This technique was used to study the relationship between repassivation kinetics and stress corrosion cracking (SCC) susceptibility for Ti 8A1‐1M0‐1V alloy. In these studies the effect of the rate of film growth on the amount of metal dissolution which occurs during the repassivation process was investigated by comparing the repassivation transient behavior in a 1.0N normalNaCl solution, where cracks have been found to propagate, to that in a 1.0N NaNO3 solution where SCC susceptibility has never been detected. Film growth kinetics in both solutions were consistent with a Fleischmann‐Thirsk mechanism of oxide patch nucleation and two‐dimensional growth, although the film growth rate was significantly slower in the 1.0N normalNaCl solution. Low film growth rate led to an increase in metal dissolution in a solution where crack propagation velocities have been measured, but at an apparent rate slower than necessary to propagate such cracks by metal dissolution alone.

No abstract