Palladium (Pd) nanoparticles (5-20 nm) are used as the sensing layer on surface acoustic wave (SAW) devices for detecting H2. The interaction with hydrogen modifies the conductivity of the Pd nanoparticle film, producing measurable changes in acoustic wave propagation, which allows for the detection of this explosive gas. The nanoparticle-based SAW sensor responds rapidly and reversibly at room temperature.

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A simple and straightforward method of depositing nanostructured thin films, based on LiCl-doped TiO 2 , on glass and LiNbO 3 sensor substrates is demonstrated. A spin-coating technique is employed to transfer a polymer-assisted precursor solution onto substrate surfaces, followed by annealing at 520°C to remove organic components and drive nanostructure formation. The sensor material obtained consists of coin-shaped nanoparticles several hundred nanometers in diameter and less than 50 nm thick. The average thickness of the film was estimated by atomic force microscopy (AFM) to be 140 nm. Humidity sensing properties of the nanostructured material and sensor response times were studied using conductometric and surface acoustic wave (SAW) sensor techniques, revealing reversible signals with good reproducibility and fast response times of about 0.75 s. The applicability of this nanostructured film for construction of rapid humidity sensors was demonstrated. Compared with known complex and expensive methods of synthesizing sophisticated nanostructures for sensor applications, such as physical vapor deposition (PVD) and chemical vapor deposition (CVD), this work presents a relatively simple and inexpensive technique to produce SAW humidity sensor devices with competitive performance characteristics.

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The formation of a siloxane self-assembled monolayer (SAM) film on a lithium niobate substrate was investigated for surface acoustic wave (SAW) sensor devices for the detection of hydrogen. The most widely used SAM coupling reagent, octadecyltrichlorosilane, etches aluminum metal features that are integral to sensor devices, due to the formation of high local concentrations of hydrochloric acid. An alternative coupling reagent, octadecyltrimethoxysilane (OTMS), does not show any etching of metal parts. OTMS and related molecules are compatible with conventional SAW device manufacturing techniques and other devices that contain metal features susceptible to etching by acid released in the SAM formation process.