GRCop-42 is a high conductivity, high-strength dispersion strengthened copper-alloy for use in high heat flux applications such as liquid rocket engine combustion devices. This alloy is part of the family of NASAdeveloped GRCop, copper-chrome-niobium alloys. GRCop alloys were developed for harsh environments specific to regeneratively-cooled combustion chambers and nozzles with good oxidation resistance. Significant development was completed on the GRCop-84 and GRCop-42 alloys in the extruded wrought form demonstrating feasibility for combustion chambers. NASA has recently developed a process for additive manufacturing, specifically Powder Bed Fusion (PBF) or Selective Laser Melting (SLM), of GRCop-42 to establish parameters, characterize the material, and complete testing of components with complex internal features. This evolution of the GRCop-42 was based on the successful predecessor development work using GRCop-84 with the motivation of establishing a new copper-alloy option for use in NASA, government, and industry programs with SLM. A few advantages have been shown with the GRCop-42 that include higher conductivity and faster build speeds over the GRCop-84, and a simplified powder supply chain. Initial property development has shown that it is possible to produce high density builds with strengths equivalent to wrought GRCop-42 and a conductivity greater than GRCop-84. The GRCop-42 has completed process development and initial properties have been established. Several demonstrator combustion chambers have also been fabricated with the SLM GRCop-42 that include integral channels and closeouts. Additional test units have been fabricated and are completing substantial hot-fire testing to demonstrate performance of the material, process, and design.
Abstract-The fluidic packaging of Power MEMS devices such as the MIT microengine and microrocket requires the fabrication of hermetic seals capable of withstanding temperature in the range 20-600 C and pressures in the range 100-300 atm. We describe an approach to such packaging by attaching Kovar metal tubes to a silicon device using glass seal technology. Failure due to fracture of the seals is a significant reliability concern in the baseline process: microscopy revealed a large number of voids in the glass, pre-cracks in the glass and silicon, and poor wetting of the glass to silicon. The effects of various processing and materials parameters on these phenomena were examined. A robust procedure, based on the use of metal-coated silicon substrates, was developed to ensure good wetting. The bending strength of single-tube specimens was determined at several temperatures. The dominant failure mode changed from fracture at room temperature to yielding of the glass and Kovar at 600 C. The strength in tension at room temperature was analyzed using Weibull statistics; these results indicate a probability of survival of 0 99 at an operational pressure of 125 atm at room temperature for single tubes and a corresponding probability of 0 9 for a packaged device with 11 joints. The residual stresses were analyzed using the method of finite elements and recommendations for the improvement of packaging reliability are suggested.[933]Index Terms-Kovar silicon seal, microengine, microfluidic packaging, Power MEMS.
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