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Маршаков, А. И.; Ignatenko, V. E.

doi:10.1023/a:1003407805303

Cited by 3 publications

(2 citation statements)

References 6 publications

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“…The critical concentration of hydrogen peroxide ( C Ox,crit ) in a particular environment can be calculated according to reference [13,16,23,26,27]: where , and are the concentrations of H + , and ions respectively; , and are the diffusivities of H + , , ions, and hydrogen peroxide, respectively; m is the number of hydrogen ions formed as a result of ion dissociation; and P is the number of hydrogen ions consumed in the reduction of a hydrogen peroxide molecule.…”

Section: Resultsmentioning

confidence: 99%

Effect of hydrogen peroxide on crack growth rate in X70 pipeline steel in weak acid solution

Bogdanov

Маршаков

Ignatenko

et al. 2017

Corrosion Engineering, Science and Technology

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An investigation of the effect of hydrogen peroxide (H 2 O 2 ) on corrosion crack growth can be considered as a necessary stage in a study of the SCC of pipeline steels in the presence of dissolved oxygen and other oxidants. It was found that the presence of hydrogen peroxide at a low concentration (5 mM) results in a deceleration of the crack growth. With an increase in the concentration of H 2 O 2 , the crack growth rate increases. The change in the steel corrosion rate at various H 2 O 2 concentrations agrees with the dependence of the crack growth rate on the oxidant concentration. The conclusion has been made that the crack growth in a weakly acidic electrolyte (pH 5.5) is determined by the metal dissolution process. Hydrogen charging of the metal indirectly affects the crack growth by increasing the surface coverage with hydrogen, which decreases the steel dissolution rate.

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Section: Resultsmentioning

confidence: 99%

Effect of hydrogen peroxide on crack growth rate in X70 pipeline steel in weak acid solution

Bogdanov

Маршаков

Ignatenko

et al. 2017

Corrosion Engineering, Science and Technology

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“…4,5 This implies that normally reducing hydroxylamine becomes converted to an oxidizing-type compound during the reactive chemical process. Voltammetric and other electrochemical measurement techniques [6][7][8][9][10] have been employed to study the reactive nature of hydroxylamine toward transition metals. Electroreduction of NO on a single crystal of gold revealed a direct transition to hydroxylamine.…”

mentioning

confidence: 99%

Radical Formation in Hydroxylamine-Copper Chemical Mechanical Planarization Processes

Carter

Small

2003

J. Electrochem. Soc.

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Hydroxylamine is commonly employed in laboratory chemistry as a reducing agent, such as for reduction of Cu͑II͒ to Cu͑I͒, yet a sulfate salt oxidizes copper during chemical mechanical planarization ͑CMP͒ processing employed in the manufacture of semiconductors. Electrochemical, Fourier transform infrared, and electron paramagnetic resonance measurements were conducted to verify formation of a nitrosyl radical complex, similar to Fremy's salt, that is believed to be the molecular species responsible for catalytic copper oxidation during CMP processing.Semiconductor memory devices fabricated with submicrometer copper interconnect traces typically employ chemical mechanical planarization ͑CMP͒ of the silicon wafers following deposition of the copper interconnect layer. The CMP process removes excess metal, resolves individual conductor traces, and produces a planarized base for fabrication of the succeeding layers. Metal CMP may be considered a process of chemical oxidation of the surface metal layer with concomitant removal of the oxidized surface using a microslurry polish. Several classical chemical oxidizing agents, including hydrogen peroxide, peracetic acid, ammonium persulfate, and ferric nitrate, have been used to oxidize copper. The rate of copper metal removal during CMP processing of copper-coated wafers using hydrogen peroxide is believed to be related to the concentration of hydroxyl radical. 1 Soluble complexes of iron and copper have been reported 1 to promote production of the hydroxyl radical, speeding copper removal by CMP. Application of copper complexing agents under CMP conditions, in the absence of hydrogen peroxide, may also function as oxidizing agents to affect the removal rate of copper as well.Hydroxylamine, a strong reducing agent, is known to reduce soluble copper as Cu(II) → Cu(I) and soluble manganese as Mn(III) → Mn(II), 2,3 yet copper metal becomes oxidized in the presence of hydroxylamine sulfate or nitrate during CMP processing. Nitrogen atoms found in common nitrogen-containing compounds reside in oxidation states between Ϫ3 or N Ϫ3 and ϩ5 or N ϩ5 . Hydroxylamine is an intermediate nitrogen, and others that have been well documented. Nitrogen compounds from nitrous oxide through nitrate are clearly oxidizing agents, while those including ammonia through hydroxylamine are considered to be reducing agents with nitrogen gas being a relatively unreactive neutral compound. Previous efforts have been conducted employing hydroxylamine-based slurries for CMP of copper films for which the chemical oxidation of copper metal was proposed to be a free radical process. 4,5 This implies that normally reducing hydroxylamine becomes converted to an oxidizing-type compound during the reactive chemical process. Voltammetric and other electrochemical measurement techniques 6-10 have been employed to study the reactive nature of hydroxylamine toward transition metals. Electroreduction of NO on a single crystal of gold revealed a direct transition to hydroxylamine. 9 Voltammetric determination of hydr...

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Inhibitory effect of tungstate, molybdate and nitrite ions on the carbon steel pitting corrosion in alkaline formation water containing Cl− ion

Deyab

El‐Rehim

2007

Electrochimica Acta

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Untitled

Cited by 3 publications

References 6 publications

Effect of hydrogen peroxide on crack growth rate in X70 pipeline steel in weak acid solution

Effect of hydrogen peroxide on crack growth rate in X70 pipeline steel in weak acid solution

Radical Formation in Hydroxylamine-Copper Chemical Mechanical Planarization Processes

Inhibitory effect of tungstate, molybdate and nitrite ions on the carbon steel pitting corrosion in alkaline formation water containing Cl− ion

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