THE MANUFACTURING YIELDS of high density dynamic RAMs are controlled by inspecting visually photo-resist patterns for defects, testing defect monitors in the product kerf, and analyzing final test data'. Data from these measurements are transformed with yield models into product yields. Thus it is possible to determine all of the yield detractors accurately. The yield losses for 64K chips are shown in relative units in Figure 1.the yield of the product before it reaches final test. The predictive value of the…
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