Voltammetric Response of Water in Deep Eutectic Solvent Based on Choline Chloride and Urea

Bučko, Mihael; Roy, Sudipta; Valverde-Armas, Priscila E.; Onjia, Antonije; Bastos, A.C.; Bajat, Jelena B.

doi:10.1149/2.0921816jes

Cited by 11 publications

(7 citation statements)

References 32 publications

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“…In contrast to the results for ethaline, the effect of water on other DES systems, such as reline, can be significant [8,36]. For example, Du [8] reported that the electrochemical window reduced from 2.54 V to 1.03 V at a glassy carbon electrode when the water content was changed from 1 wt% to 12 wt%, similar to the range considered in this work.…”

Section: Effect Of Water On Electrochemical Windowsupporting

confidence: 59%

“…In the absence of water, the anodic and cathodic limits are attributed to the reduction of the choline cation and the oxidation of Clto Cl2, respectively [8,10,36]. With added water, many other reactions are possible [10] and the situation for reline seems particularly complex [36]. It should be noted that even though conventional RTILs can have very large (e.g.…”

Section: Effect Of Water On Electrochemical Windowmentioning

confidence: 99%

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Effect of water on the electrodeposition of copper from a deep eutectic solvent

2020

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This study has examined the effect of water on the electrodeposition of copper from a deep eutectic solvent (DES). Initial physiochemical measurements showed that the viscosity and resistivity of the DES decreased with added water in the range 1 -15 wt%. This reduction in viscosity resulted in an increase in the mass transfer limiting current, without narrowing the electrochemical window or altering the speciation of the copper chloro-complexes. This shows that metal deposition rates can be increased by water additions. The effect of water on the electrochemical kinetics of the Cu(I) and Cu(II) chloro-complexes was also studied. It was found that the kinetics of the Cu(I)/Cu(0) reaction is largely irreversible, while the Cu(II)/Cu(I) couple was quasi-reversible. The rate constants for Cu(II)/Cu(I) and Cu(I)/Cu(0) reactions were accelerated by water additions, although the transfer coefficients remained unchanged. The effect of increased deposition rates, electrolyte conductivity and reaction kinetics on deposit uniformity was estimated and subsequently verified by experiments. It was found that, although higher deposition rates could be achieved, the thickness of the deposit was non-uniform since the Wagner numbers remained relatively low.

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Section: Effect Of Water On Electrochemical Windowsupporting

confidence: 59%

Section: Effect Of Water On Electrochemical Windowmentioning

confidence: 99%

Effect of water on the electrodeposition of copper from a deep eutectic solvent

2020

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“…In general, water in DES decreases its kinematic viscosity (Figure 5), increases its electrical conductivity, and notably narrows its electrochemical window [82,84], and all these factors contribute to the increase in the corrosion processes rate. Consequently, it was shown in [85] that the corrosion of mild steel in ethaline and reline is significantly enhanced even with the addition of only 10 wt.% of water.…”

Section: Effect Of Water Contentmentioning

confidence: 99%

A Review of the electrochemical corrosion of metals in choline chloride based deep eutectic solvents

Bučko

Bajat

2021

J. Electrochem. Sci. Eng.

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Deep eutectic solvents (DESs) are a class of mixtures with melting points notably lower than those of their raw constituent components. These liquids have found a tremendously wide spectrum of applications in the last two decades of their research, so their contact and interaction with technical metals and alloys are inevitable. Therefore, the corrosivity of DESs towards metals is an extremely important topic. This review summarizes research efforts collected in the last two decades related to the corrosion rate of various metals in different DESs. Since the DESs are mainly composed of organic raw compounds, and by their physicochemical properties they may be regarded as a separate class of ionic liquids, the literature data about DESs corrosivity has been compared to the data related to the corrosivity of various organic solvents and ionic liquids as well. All the results gained until now show significantly low corrosivity of DESs. This observation is discussed in relation to the chemical composition of DESs. The absence of the oxidizing agents, the inhibitory action of organic ions and molecules, high viscosity and low electrical conductivity have been recognized as the main factors contributing to the low metal corrosion rate in DESs.

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“…11 It is well known that choline chloride based DESs are extremely hygroscopic mixtures, so they contain some percent of water, which is electroreduced at the cathode during the electrodeposition, by the same mechanism as in aqueous electrolytes. 12,13 Therefore, it would be interesting to calculate the pH change in the vicinity of the cathode during the electrodeposition process, and to compare the results for DESs with those for an aqueous solution.…”

Section: Calculation Of Surface Ph During the Electrodeposition Processmentioning

confidence: 99%

The importance of using hydrogen evolution inhibitor during the Zn and Zn-Mn electrodeposition from ethaline

Bučko¹,

Tomić

Maksimović

et al. 2019

JSCS

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Cyclic voltammetry was used for the characterization of zinc electrodeposition on steel from ethaline deep eutectic solution (1:2 choline chloride:ethylene glycol). The influence of 4-hydroxy-benzaldehyde (HBA) as an additive was analyzed. It was shown that hydrogen evolution is inhibited in the presence of HBA and further significantly retarded upon addition of Zn 2+ to the solution containing HBA. The cathodic peak for Zn 2+ reduction in this type of ionic liquid (ethaline+HBA+Zn 2+) resembles the zinc reduction in aqueous solution. The corrosion resistance of Zn coatings deposited at different current densities was evaluated by electrochemical methods, i.e., polarization measurements and electrochemical impedance spectroscopy in 3 % NaCl solution. The possibility of Zn-Mn alloy deposition from ethaline deep eutectic solvent was investigated for the first time. In addition, the corrosion stability of these alloy coatings was analyzed and compared to the stability of bare Zn coatings. It was shown that the optimum deposition current density for both Zn and Zn-Mn coatings with increased corrosion stability from ethaline + HBA electrolyte is 5 mA cm ˗2 .

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Voltammetric Response of Water in Deep Eutectic Solvent Based on Choline Chloride and Urea

Cited by 11 publications

References 32 publications

Effect of water on the electrodeposition of copper from a deep eutectic solvent

Effect of water on the electrodeposition of copper from a deep eutectic solvent

A Review of the electrochemical corrosion of metals in choline chloride based deep eutectic solvents

The importance of using hydrogen evolution inhibitor during the Zn and Zn-Mn electrodeposition from ethaline

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