Variation of residual stress in cubic boron nitride film caused by hydrogen addition during unbalanced magnetron sputtering

Kim, H.-S.; Park, J.-K.; Lee, W.-S.; Baik, Young‐Joon

doi:10.1016/j.tsf.2011.06.092

Cited by 21 publications

(5 citation statements)

References 18 publications

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“…[18] The c-BN phase content (volume fraction) can be estimated from the relative intensities of c-BN (∼1080 cm −1 ) and h-BN (∼1380 cm −1 ). [5] The c-BN content values are 52%, 56%, and 85% for the 0.4 µm, 1.2 µm, and 1.8 µm thick films, respectively. Also, as shown in Fig.…”

Section: Combination Of Interlayer and Two Stage Processmentioning

confidence: 94%

“…The cubic boron nitride (c-BN) films have many desirable properties and have been used in many industry fields. [1][2][3][4][5] One of the promising application fields, which has long been expected, is to use the c-BN film as a protective coating for cutting tools, because it possesses outstanding mechanical properties such as high hardness, wear resistance, and chemical inertness to ferrous metals at high temperatures. [2][3][4][5][6] The films are always required to be thick enough in order to play a protective role.…”

Section: Introductionmentioning

confidence: 99%

“…[1][2][3][4][5] One of the promising application fields, which has long been expected, is to use the c-BN film as a protective coating for cutting tools, because it possesses outstanding mechanical properties such as high hardness, wear resistance, and chemical inertness to ferrous metals at high temperatures. [2][3][4][5][6] The films are always required to be thick enough in order to play a protective role. One of the great hurdles, which restricts its practical usage, is the high compressive stress and the poor adhesion to most of the substrates.…”

Section: Introductionmentioning

confidence: 99%

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Preparation and characterization of thick cubic boron nitride films

Ming-E¹,

Ma²,

Chen³

et al. 2014

Chinese Phys. B

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Section: Combination Of Interlayer and Two Stage Processmentioning

confidence: 94%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Preparation and characterization of thick cubic boron nitride films

Ming-E¹,

Ma²,

Chen³

et al. 2014

Chinese Phys. B

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“…Chemical vapor deposition (CVD) and physical vapor deposition (PVD) can be utilized to provide a high-energy ion bombardment on the growing surface and this leads to accumulation of the compressive stress [35][36][37][38][39]. The compressive stress can be diminished by introducing 25% hydrogen into the reactive gasses [40][41][42][43]. By using CVD and sputter processes, c-BN films can be fabricated with a thickness more than 1 μm [44][45][46].…”

Section: Boron Nitride (Bn) Thin Filmsmentioning

confidence: 99%

A brief overview of RF sputtering deposition of boron carbon nitride (BCN) thin films

2018

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A great part of interest has been paid for fabricating new materials with novel mechanical, optical, and electrical properties. Boron carbon nitride (BCN) ternary system was applied for variable bandgap semiconductors and systems with extreme hardness. The purpose of this literature review is to provide a brief historical overview of B 4 C and BN, to review recent research trends in the BCN synthesizes, and to summarize the fabrication of BCN thin films by plasma sputtering technique from B 4 C and BN targets in different gas atmospheres. Pre-set criteria are used to discuss the processing parameters affecting BCN performance which includes the gasses flow ratio and effect of temperature. Moreover, many characterization studies such as mechanical, etching, optical, photoluminescence, XPS, and corrosion studies of the RF sputtered BCN thin films are also covered. We further mentioned the application of BCN thin films to enhance the electrical properties of metal-insulator-metal (MIM) devices according to a previous report of Prakash et al. (Opt. Lett. 41, 4249, 2016).

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“…[27,28] Recently, it was suggested that adding 25% hydrogen into the reactive gases would reduce the compressive stress. [29][30][31][32] Combining with a nanocrystalline diamond (NCD) as the gradient layer from Si substrate, 3-µm-thick c-BN films have been deposited by an unbalanced magnetron sputtering method. [33] Theoretical and experimental studies demonstrated that the incorporation of hydrogen into the reactive working plasma is known to preferentially stabilize the cubic structure of BN on the edges of h-BN in the CVD process.…”

Section: Introductionmentioning

confidence: 99%

Thick c-BN films deposited by radio frequency magnetron sputtering in argon/nitrogen gas mixture with additional hydrogen gas

et al. 2016

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The excellent physical and chemical properties of cubic boron nitride (c-BN) film make it a promising candidate for various industry applications. However, the c-BN film thickness restricts its practical applications in many cases. Thus, it is indispensable to develop an economic, simple and environment-friend way to synthesize high-quality thick, stable c-BN films. High-cubic-content BN films are prepared on silicon (100) substrates by radio frequency (RF) magnetron sputtering from an h-BN target at low substrate temperature. Adhesions of the c-BN films are greatly improved by adding hydrogen to the argon/nitrogen gas mixture, allowing the deposition of a film up to 5-µm thick. The compositions and the microstructure morphologies of the c-BN films grown at different substrate temperatures are systematically investigated with respect to the ratio of H 2 gas content to total working gas. In addition, a primary mechanism for the deposition of thick c-BN film is proposed.

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Variation of residual stress in cubic boron nitride film caused by hydrogen addition during unbalanced magnetron sputtering

Cited by 21 publications

References 18 publications

Preparation and characterization of thick cubic boron nitride films

Preparation and characterization of thick cubic boron nitride films

A brief overview of RF sputtering deposition of boron carbon nitride (BCN) thin films

Thick c-BN films deposited by radio frequency magnetron sputtering in argon/nitrogen gas mixture with additional hydrogen gas

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