volume 32, issue 15, P1021-1027 1992
DOI: 10.1002/pen.760321507
View full text
|
|
Share

Abstract: Vacuum deposition of metal coatings on polyetherimide was investigated. High levels of adhesion ( > 170 g/mm) with evaporated copper were achieved through a primarily chemical interaction. Changes in the interfacial chemistry were correlated with metal/polymer adhesion. Vacuum deposition of aluminum onto polyetherimide was also examined and found to yield much lower adhesion.