2002
DOI: 10.1109/22.989967
|View full text |Cite
|
Sign up to set email alerts
|

Vacuum electronics

Abstract: This paper explores the recent history and diversity of this remarkable technology, with emphasis on recent advances in the more traditional device types (traveling-wave tube and klystron), as well as more recent innovations such as the microwave power module, inductive output amplifier, fast-wave devices, ultrahigh-power sources, and RF vacuum microelectronics. These advances can be credited to a combination of device innovation, enhanced understanding gained through improved modeling and design, the introduc… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
1
1

Citation Types

0
49
0
1

Year Published

2005
2005
2014
2014

Publication Types

Select...
5
4

Relationship

0
9

Authors

Journals

citations
Cited by 155 publications
(50 citation statements)
references
References 40 publications
0
49
0
1
Order By: Relevance
“…[93][94][95] In general, two different types of μw sources can be distinguished: solid-state and vacuum electronic devices. Figure 10 provides an overview of high-frequency μw sources available currently.…”
Section: A Microwave Sourcesmentioning
confidence: 99%
“…[93][94][95] In general, two different types of μw sources can be distinguished: solid-state and vacuum electronic devices. Figure 10 provides an overview of high-frequency μw sources available currently.…”
Section: A Microwave Sourcesmentioning
confidence: 99%
“…Applications that rely on field emission will benefit, and such applications include (but are not limited to): electron beam lithography [22,23] and transmission electron microscopes [24]; spacecraft propulsion [25,26]; mm-wave Vacuum Electronic amplifiers and THz devices [27,28]; and particle accelerators and Free Electron Lasers (FEL's) [29][30][31].…”
Section: Introductionmentioning
confidence: 99%
“…[1,2] As the working frequency rises to upper millimeter wave range (100-300 GHz), the transverse sizes of slow-wave circuits become so small that the traditional machining technique can no longer meet the requirements of the fine machining tolerances, the adequate costs and high yield of fabrication. [1,2] The machining problem derived from the traditional manufacturing process, have caused fast rising loss in output power and bandwidth at higher frequency, prohibiting both traditional helix-TWTs and coupled cavity TWTs from upper millimeter wave frequency application. [1][2][3][4] Unfortunately, the traditional helix and coupled cavity slow-wave circuits are not compatible with microfabrication technology, due to their intrinsic shortcomings in structures.…”
Section: Introductionmentioning
confidence: 99%
“…[1,2] The machining problem derived from the traditional manufacturing process, have caused fast rising loss in output power and bandwidth at higher frequency, prohibiting both traditional helix-TWTs and coupled cavity TWTs from upper millimeter wave frequency application. [1][2][3][4] Unfortunately, the traditional helix and coupled cavity slow-wave circuits are not compatible with microfabrication technology, due to their intrinsic shortcomings in structures. [3,4] In order to overcome the structural limitations, it is very necessary to develop novel slow-wave structures and microfabrication technology for next generation TWTs on upper millimeter wave band or even higher frequency.…”
Section: Introductionmentioning
confidence: 99%