“…In this paper, the degradation is modeled using the (normalized) power law equation: where M is the normalized performance metric of interest, C 1 and N are the model fit parameters which in this instance are shown as functions of temperature. Such power law dependence is observed for degradation of contact resistance of mechanical switches (McLinn, 2016), trapping/de-trapping of charge carriers at the gate oxide interface in CMOS devices (Ma et al , 2016), or creep of solder joints (Kumar et al , 2012). This performance metric could be similarly modeled as a function of other environmental stressors like humidity, voltage, current, etc.…”