Trend from ICs to 3D ICs to 3D systems

Tummala, Rao; Sundaram, Venky; Chatterjee, Ritwik; Raj, P. Markondeya; Kumbhat, Nitesh; Sukumaran, Vijay; Sridharan, Vivek; Choudury, Abhishek; Qiao, Chunming; Bandyopadhyay, Tapobrata

doi:10.1109/cicc.2009.5280817

Cited by 47 publications

(13 citation statements)

References 27 publications

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“…There are various implementation options for inductors such as spiral, meander, helical inductors, and also 3D micro machined inductors. However, for inductor designs, a good figure of merit would be on that takes into account the area occupied by the inductor, the inductance and Q factor achieved [10]. An inductor topology based on through package vias, shown in Fig.…”

Section: Novel Passive Componentsmentioning

confidence: 99%

Design and fabrication of bandpass filters in glass interposer with through-package-vias (TPV)

Sridharan

Min

Sukumaran

et al. 2010

2010 Proceedings 60th Electronic Components and Technology Conference (ECTC)

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This paper presents the integration of WLAN (2.4 and 5GHz) bandpass filters in glass interposer using throughpackage vias. The filters include novel embedded passive components such as stitched capacitors with reduced shunt parasitics and via-based inductors that provide area reduction. The filters designed for 2.4 GHz showed an insertion loss of less than 2dB and better than 15dB return loss, while the 5GHz filters showed an insertion loss of less than 1dB with better than 20dB return loss. Stop-band rejection of over 35dB was observed at 2.2 GHz on the 2.4 GHz bandpass filters. The measured results showed good agreement with the simulated values and indicated that the performance on glass interposer closely matches the performance of the more expensive high resistivity silicon with similar properties.

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Section: Novel Passive Componentsmentioning

confidence: 99%

Design and fabrication of bandpass filters in glass interposer with through-package-vias (TPV)

Sridharan

Min

Sukumaran

et al. 2010

2010 Proceedings 60th Electronic Components and Technology Conference (ECTC)

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“…However, silicon interposers have their own limits in cost and electrical performance. Glass appears to be an ideal candidate for interposers that addresses the limits of both organic and silicon substrates [1]. Glass is an attractive material for interposers due to its silicon matched-CTE, excellent surface flatness, dimensional stability, high electrical resistivity and availability in thin and large panels at low cost [2].…”

Section: Introductionmentioning

confidence: 99%

Thermomechanical and electrochemical reliability of fine-pitch through-package-copper vias (TPV) in thin glass interposers and packages

Demir

Ramachandran

Sato

et al. 2013

2013 IEEE 63rd Electronic Components and Technology Conference

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This paper reports reliability of copper-plated throughpackage-vias (TPVs) in glass interposer by modeling and experimental validation using accelerated life tests. In this paper, both thermomechanical reliability and electrochemical reliability of fine-pitch TPVs in glass interposer were investigated. Thermomechanical reliability was investigated by developing finite element models to calculate the thermomechanical stresses and strains inside TPVs during thermal cycling tests with several glass and polymer liner combinations. Fatigue lifetime of TPVs in glass is predicted based on these simulation results and then validated using experiments. Test samples with daisy chains of TPVs are fabricated with different glass and polymer material combinations and subjected to accelerated temperature cycling tests to assess the thermomechanical reliability of TPVs in glass interposer. Resistance of each daisy chain is monitored using 4-point probe during cycling. It is observed that majority of test samples passed 1000 thermal cycles without any significant changes in electrical resistance. Crosssectioning of TPV daisy chains that showed significant changes in resistance, revealed that failures were related to defects induced during copper plating in TPV side walls. Electrochemical migration reliability of TPVs in glass was investigated to study conductive anodic filament (CAF) resistance of glass at very small via spacing. Test samples with different material combinations were subjected to biased and highly accelerated stress temperature-humidity test (HAST) to assess electrochemical migration reliability of TPVs. After biased-HAST for 100 hours at 130 o C, 85% relative humidity (RH) and 5 V DC, no CAF failures were detected in either of the two material combinations, indicating good insulation reliability under high temperature and humidity conditions.

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“…21, the large needle-shaped IMC particles may correspond to Ag 3 Sn because analysis revealed the presence of Ag, whereas the large plate-shaped IMC particles may correspond to Au 4 Sn because analysis revealed the presence of Au. It is well known that needle-shaped Ag 3 Sn and plate-shaped Au 4 Sn are formed in solder bulk during Sn-Ag-Cu soldering on ENIG surface finish (reflow), isothermal aging, and thermo-mechanical cycling (TMT). 1,28,[33][34][35][36][37] Large IMC particles, exhibiting brittle properties, greatly affect plastic deformation of solder.…”

Section: Observation Of the Soldering Interconnection Microstructurementioning

confidence: 99%

“…2,3 Further improvement of the FC technology is desired for expanding future applications. 1,4,5 One of the novel improvements involves the selfassembly of solder using thermoset resin, namely, epoxy resin and solder powder, Sn-58Bi. [6][7][8][9][10][11] Figure 1 shows the method employed for the selfassembly of the electrically conductive path of solder between the pads and the concurrent formation of underfill during the reflow process.…”

Section: Introductionmentioning

confidence: 99%

Self-assembly of Sn-3Ag-0.5Cu Solder in Thermoplastic Resin Containing Carboxyl Group and its Interconnection

Miyauchi

Yamashita

Suzuki

et al. 2014

Journal of Elec Materi

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The self-assembly of solder powder on pads is attractive as a novel interconnection method between chips and substrates. However, the solder used in this method is limited to Sn-58Bi and Sn-52In. In contrast, Sn-3Ag-0.5Cu has been relatively less studied despite its wide use as a lead-free solder in assembling semiconductor packages. Hence, here, polymeric materials incorporating Sn-3Ag-0.5Cu solder powder were investigated for the self-assembly of the solder on pads at temperatures up to 260°C in a lead-free reflow process. The self-assembly of the solder was observed with an optical microscope through transparent glass chips placed on substrates covered with the polymeric materials incorporating the solder powder. Differential scanning calorimetry measurements were performed to confirm the behaviors of the reaction of the resins and the melting of the solder. When epoxy resin with a fluxing additive was used as a matrix, self-assembly of the solder was prevented by the cross-linking reaction. Conversely, when thermoplastic resin containing carboxyl groups was used as a matrix, the self-assembly of solder was successfully achieved in the absence of fluxing additives. The shear strength of interconnection using reflowfilm with lamination was sufficient and significantly increased during the reflow process. However, the shear strength of the reflowfilm showed cohesive failure, possibly because of the brittle intermetallic compounds (Ag 3 Sn, Au 4 Sn) network in bulk was lower than that of conventional solder paste that showed interfacial failure after the reflow process with a rapid cooling rate.

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Trend from ICs to 3D ICs to 3D systems

Cited by 47 publications

References 27 publications

Design and fabrication of bandpass filters in glass interposer with through-package-vias (TPV)

Design and fabrication of bandpass filters in glass interposer with through-package-vias (TPV)

Thermomechanical and electrochemical reliability of fine-pitch through-package-copper vias (TPV) in thin glass interposers and packages

Self-assembly of Sn-3Ag-0.5Cu Solder in Thermoplastic Resin Containing Carboxyl Group and its Interconnection

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