Transient liquid phase diffusion bonding of Al/Mg2Si metal matrix composite

Spectroscopic Analyses of Nano-Dispersion Strengthened Transient Liquid Phase Bonds

“…Therefore, as the width of the particle segregated zone increased the ductility of the joint decreases. This leads to embrittlement of the joint region and causes a reduction in joint strength [38,39,40,41]. The findings published in the scientific literature supports the results collected in this study.…”

Microstructure and mechanical properties of transient liquid phase bonding of /Al nanocomposite using copper interlayer

“…Thus, at bonding temperature of 580°C, 40 min time is not sufficient to complete the isothermal solidification. Formation of these compounds by eutectic reaction during cooling of joint has been reported in literature [14,15,21]. By increasing the bonding time to 60 min, no significant eutectically solidified structures can be observed, so the bonding time of 60 min probably has enough to complete isothermal solidification.…”

“…If the base metal has micronic reinforcement particles, while the liquid phase was created in the joint seam, the reinforcement particles that have been trapped in the composite matrix, were and agglomerated in the joint seam. Agglomeration of micronic reinforcement particles to the bond region has been reported in TLP bonding of TiCp/AZ91D [14,15] and Al MMCs [21]. The agglomerated particles in the joint seam reduced the bond strength, significantly [7].…”

Effect of Interfacial Hardness on Failure Modes of Liquid Phase Diffusion Bonded Sn/Sn with Bi Filler

“…However, the real joining surface had large and small irregularities and use big plastic deformation to ll these gap or couldn t but joint it in a liquid phase state. Therefore, in this study, we tried the application to the micro junction of the liquid phase diffusion joining method with the results by the joining of the large material [14][15][16][17][18][19][20] . An advantage of the liquid phase diffusion joining method is that the melting point of the junction rises when the joining process is nished.…”