Through Mold Via (TMV) by gas-aided laser

Hsu, Hsiang-Chen; Wu, Shih-Jeh; Lin, Wen-Fei; Hsi, Chi‐Shiung; Pao, Hsing-Yi; Wang, Pin-Chieh

doi:10.1109/icep.2016.7486897

Cited by 2 publications

(3 citation statements)

References 5 publications

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“…The 1000 μm thickness compound was tested by two ultrafast picosecond lasers and thinner compounds, such as 100 μm thickness was applied to determine and verify the optimal parameters for removing fillers and 200 μm thickness was used for repeatability test. All DOE laser parameters can be found in 12 .…”

Section: Resultsmentioning

confidence: 99%

“…Since the edge quality of sidewall on drilled via plays an important role for high speed interconnection, many researchers 8–12 have demonstrated many reliability design rules on the TMV bottom PoP packages in recent years. Among these, a so-called gas-aided laser technology 12 was developed to improve the edge quality of sidewall on the trench. Oxygen (O 2 ) gas could increase the inflammation and noble gases, such as Argon (Ar) and Nitrogen (N 2 ) would decrease the oxidation during laser process.…”

Section: Introductionmentioning

confidence: 99%

“…Random filler leakage on the sidewall was reported 12 and the surface integrity of trench, such as debris, recast, ripple … etc, should be avoided during fabrication all the time. The ideal condition for trench formation is straight via with uniform width, however, the tapered via always formed due to the optical characteristic of aspect ratio.…”

Section: Introductionmentioning

confidence: 99%

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Reliability Design and Optimization Process on through Mold via using Ultrafast Laser

Hsu

Lin

et al. 2018

Polymers and Polymer Composites

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In this study, a through mold via (TMV) process using ultrafast Laser has been developed for the interconnection on 3D package-on-package (PoP) application. Epoxy molding compound (EMC) is a composite material consisted of epoxy resin, filler particles (fused silica) and other constituents. Among these chemical compositions, the size and spatial distribution of fillers on the EMC dominate the sidewall quality on drilled trench. However, random filler leakage on the sidewall leads to an irregular and uneven trench and these drop out fillers become a problem needed to be solved. Faster removal of debris can be achieved by controlling the laser drilling parameters. Parametric studies have been performed to determine the specification of trench and design rule of material. The optimal desmear process on TMV bottom PoP package developed in this study demonstrates the reliability improvement on follow-up sputtering or filling process.

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Section: Resultsmentioning

confidence: 99%