Thermal treatment and encapsulation of carbon nanotube based temperature sensors

Cagatay, Engin; Abdellah, Alaa; Lugli, Paolo

doi:10.1109/prime.2015.7251372

Cited by 1 publication

(1 citation statement)

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“…The membrane covers multiple underlying films used to develop the sensor that provides a strong base simultaneously to maintain the planarity and neutrality of the base sensing layer [33]. A UV-epoxy based encapsulant is applied on a spray coated CNT layer and evaluated against non-encapsulated sensors [169]. The encapsulated sensors produced much linear response with minimal hysteresis as compared to the unencapsulated sensors.…”

Section: Encapsulation Materialsmentioning

confidence: 99%

Wearable Printed Temperature Sensors: Short Review on Latest Advances for Biomedical Applications

Khan

Ali

Khan

et al. 2023

IEEE Rev. Biomed. Eng.

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The rapid growth in wearable biosensing devices is driven by the strong desire to monitor the human health data and to predict the symptoms of chronic diseases at an early stage. Different sensors are developed for continuous monitoring of various biomarkers through wearable and implantable sensing patches. Temperature sensor has proved to be an important physiological parameter amongst the various wearable biosensing patches. This paper highlights the recent progresses made in printing of functional nanomaterials for developing wearable temperature sensors on polymeric substrates. A special focus is given to the advanced functional nanomaterials as well as their deposition through printing technologies. The geometric resolutions, shape, physical and electrical characteristics as well as sensing properties using different materials are compared and summarized. Wearability is the main concern of these newly developed sensors, which is summarized by discussing representative examples. Finally, the challenges concerning the stability, repeatability, reliability, sensitivity, linearity, ageing, and large-scale manufacturing are discussed with future outlook of the wearable systems.

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Section: Encapsulation Materialsmentioning

confidence: 99%