1997
DOI: 10.1016/s0022-0248(97)00241-8
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Thermal simulation of the Czochralski silicon growth process by three different models and comparison with experimental results

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Cited by 70 publications
(27 citation statements)
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“…20% to 30% higher directly at the interface than at a distance of a few centimeters away from the phase boundary [38,43]. This means that the actual G values are most likely higher than the G values given in Table III.…”
Section: Discussionmentioning
confidence: 99%
“…20% to 30% higher directly at the interface than at a distance of a few centimeters away from the phase boundary [38,43]. This means that the actual G values are most likely higher than the G values given in Table III.…”
Section: Discussionmentioning
confidence: 99%
“…These numerical simulations were carried out with the commercial FEM code FIDAP TM [3]. Usually, it is necessary to make some assumptions and simplifications for efficient calculations of global temperature fields [4][5][6][7][8][9]. The rather high Rayleigh number within the inert gas indicates a high level of convection.…”
Section: Numerical Modelsmentioning
confidence: 99%
“…[16]). This is somewhat surprising as global thermal modeling has become an indispensable tool in industry since several years for developing and optimizing for example crystal growth equipment and processes [17][18][19][20]. Global thermal modeling offers the possibility to change the configuration of the experimental set-up, process parameters and physical properties on a very quick and simple basis.…”
Section: Global Thermal Modeling As a Standard Tool In Industrymentioning
confidence: 99%