volume 32, issue 10, P686-689 1992
DOI: 10.1002/pen.760321007
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Abstract: Flat packages (FPs) were formed from epoxy molding compounds with various physical properties using a transfer molding machine. The compounds were prepared by changing kinds and amounts of additives and addition methods. The thermal shock test was carried out by the following procedures. The plastic package was soaked alternately in liquid nitrogen ( -196°C) and in liquid solder (200°C) in the cycle of 140s. The median life to crack initiation was defined to be the cycles when half of the specimens exhibited…

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