Volume 2: Heat Transfer Enhancement for Practical Applications; Fire and Combustion; Multi-Phase Systems; Heat Transfer in Elec 2012
DOI: 10.1115/ht2012-58115 View full text |Buy / Rent full text
|
|

Abstract: Thermal ground planes (TGPs) are flat, thin (external thickness of 2 mm) heat pipes which utilize two-phase cooling. The goal is to utilize TGPs as thermal spreaders in a variety of microelectronic cooling applications. TGPs are novel high-performance, integrated systems able to operate at a high power density with a reduced weight and temperature gradient. In addition to being able to dissipate large amounts of heat, they have very high effective axial thermal conductivities and (because of nano-porous wicks)… Show more

Help me understand this report

This publication either has no citations yet, or we are still processing them

Set email alert for when this publication receives citations?

See others like this or search for similar articles