Volume 2: Heat Transfer Enhancement for Practical Applications; Fire and Combustion; Multi-Phase Systems; Heat Transfer in Elec 2012
DOI: 10.1115/ht2012-58115 View full text |Buy / Rent full text

Abstract: Thermal ground planes (TGPs) are flat, thin (external thickness of 2 mm) heat pipes which utilize two-phase cooling. The goal is to utilize TGPs as thermal spreaders in a variety of microelectronic cooling applications. TGPs are novel high-performance, integrated systems able to operate at a high power density with a reduced weight and temperature gradient. In addition to being able to dissipate large amounts of heat, they have very high effective axial thermal conductivities and (because of nano-porous wicks)… Show more

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