Thermal management of power electronics with liquid cooled metal foam heat sink

Li, Yongtong; Gong, Liang; Ding, Bin; Xu, Minghai; Joshi, Yogendra

doi:10.1016/j.ijthermalsci.2020.106796

Cited by 36 publications

(5 citation statements)

References 33 publications

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“…During the past decades, the heat transfer phenomenon in CMs has received considerable attention. CMs have considerable applications in advanced thermal dissipation management systems, such as compact heat exchangers (Arasteh et al, 2019;Buonomo et al, 2020;Huisseune et al, 2015;Kotresha and Gnanasekaran, 2020;Sertkaya et al, 2012), thermal energy storages (Xu et al, 2020;Yang et al, 2019), electronics heat sinks (Li et al, 2021a(Li et al, , 2021b, and fuel cells (Dukhan and Hmad, 2022;Vazifeshenas et al, 2020), due to their high surface-to-volume ratio (SA:V) (from about 500 to over 10000 m 2 /m 3 ), highly conducting lattice frameworks, ultra-low weight with high strength characteristics and ability to create tortuous flow-paths to promote mixing and disturbance of the fluid flow. Consequently, the three-dimensional vortices, such as horseshoe and arch-shaped vortex, caused by the tortuous path followed by a fluid passing through the CM further augment heat transfer Fin-andelliptical tube heat exchanger (Kim et al, 2005;Liang et al, 2022).…”

Section: Periodic Cellular Lattice Structuresmentioning

confidence: 99%

A novel trussed fin-and-elliptical tube heat exchanger with periodic cellular lattice structures

Lotfi

Sundén

2022

HFF

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Purpose This study aims to computational numerical simulations to clarify and explore the influences of periodic cellular lattice (PCL) morphological parameters – such as lattice structure topology (simple cubic, body-centered cubic, z-reinforced body-centered cubic [BCCZ], face-centered cubic and z-reinforced face-centered cubic [FCCZ] lattice structures) and porosity value ( ) – on the thermal-hydraulic characteristics of the novel trussed fin-and-elliptical tube heat exchanger (FETHX), which has led to a deeper understanding of the superior heat transfer enhancement ability of the PCL structure. Design/methodology/approach A three-dimensional computational fluid dynamics (CFD) model is proposed in this paper to provide better understanding of the fluid flow and heat transfer behavior of the PCL structures in the trussed FETHXs associated with different structure topologies and high-porosities. The flow governing equations of the trussed FETHX are solved by the CFD software ANSYS CFX® and use the Menter SST turbulence model to accurately predict flow characteristics in the fluid flow region. Findings The thermal-hydraulic performance benchmarks analysis – such as field synergy performance and performance evaluation criteria – conducted during this research successfully identified demonstrates that if the high porosity of all PCL structures decrease to 92%, the best thermal-hydraulic performance is provided. Overall, according to the obtained outcomes, the trussed FETHX with the advantages of using BCCZ lattice structure at 92% porosity presents good thermal-hydraulic performance enhancement among all the investigated PCL structures. Originality/value To the best of the authors’ knowledge, this paper is one of the first in the literature that provides thorough thermal-hydraulic characteristics of a novel trussed FETHX with high-porosity PCL structures.

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Section: Periodic Cellular Lattice Structuresmentioning

confidence: 99%

A novel trussed fin-and-elliptical tube heat exchanger with periodic cellular lattice structures

Lotfi

Sundén

2022

HFF

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“…Early on, in order to temperature-control the chip to maximize its performance, it needs to be equipped with huge heat sink fins [13][14][15][16] with cooling fans [17][18][19] to take away the heat of the chip. However, this heat dissipation solution has the disadvantages of large volume and noise.…”

Section: Introductionmentioning

confidence: 99%

Numerical Simulation on Thermoelectric Cooling of Core Power Devices in Air Conditioning

Wang¹,

Hu²,

Tang³

et al. 2023

Preprint

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Air conditioners are indispensable necessities in daily life and industrial production. However, the heat generation of their internal core power components can limit their performance release. In this work, we explore the application of thermoelectric coolers (TECs) in the field of power device heat dissipation through finite element simulation. First, we geometrically modeled the structure and typical operating conditions of core power devices in air conditioners. We compared the temperature fields in air cooling and TEC active cooling modes for high power consumption power devices in a 319 K operating environment. The simulation results show that in the single air cooling mode, the maximum temperature of the 173.8 W power device reaches 394.4 K and the average temperature reaches 373.9 K, which exceeds its rated operating temperature of 368.1 K. However, after adding TEC, the maximum temperature of the power device drops to 331.8 K at an operating current of 7.5 A and the average temperature of the device is 326.5 K. It indicates that TEC active cooling has a significant effect on the temperature control of the power device. At the same time, we also studied the effect of TEC working current on the temperature control effect of power devices. For TEC, there is a minimum working current of 5 A; when it is less than 5 A, TEC has no cooling effect; the cooling effect of TEC increases with an increase in working current. When the TEC working current is 10 A, the average temperature of the power device can be reduced to 292.9 K. This study has made a meaningful exploration of the application of TEC in chip temperature control and heat dissipation, providing a new solution for chip thermal management and accurate temperature control.

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“…The increasing density of transistors in electronic components requires an efficient heat dissipation [1]. Management of electric vehicle power batteries are essential for mileage, self-discharge, safety, and useful life of these vehicles [2].…”

Section: Introductionmentioning

confidence: 99%