2017
DOI: 10.1017/aer.2017.108
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Thermal characterisation analysis and modelling techniques for CubeSat-sized spacecrafts

Abstract: Recently, universities and Small and Medium Enterprises (SMEs) have initiated the development of nanosatellites because of their low cost, small size and short development time. The challenging aspects for these satellites are their small surface area for heat dissipation due to their limited size. There is not enough space for mounting radiators for heat dissipation. As a result, thermal modelling becomes a very important element in designing a small satellite. The paper presents detailed and simplified gener… Show more

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Cited by 8 publications
(6 citation statements)
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“…The plot shows the external temperature radiating from the AraMiS cube surface. Temperature in the inner region will be greater and will depend on the thermal resistance between the point of generation and the outer surface [35]. Case 2b: This case is similar to case 2a, but in this case the energy conversion and storage in batteries (γ = 0.23 * 0.8 i.e.…”
Section: Spacecraft Analysis Under Thermal Equilibriummentioning
confidence: 99%
“…The plot shows the external temperature radiating from the AraMiS cube surface. Temperature in the inner region will be greater and will depend on the thermal resistance between the point of generation and the outer surface [35]. Case 2b: This case is similar to case 2a, but in this case the energy conversion and storage in batteries (γ = 0.23 * 0.8 i.e.…”
Section: Spacecraft Analysis Under Thermal Equilibriummentioning
confidence: 99%
“…Thermal model of a system can be achieved as a combination of thermal capacitors and thermal resistances [31]. Consider an object that consists of N-materials stacked together as shown in Figure 20 Transient thermal model consists of thermal resistances and thermal capacitances related with the body materials of the object as shown in Figure 20(b).…”
Section: Pdm Thermal Modelmentioning
confidence: 99%
“…Thermal modeling of the PCB has been considered as an effective way to evaluate the capability of thermal diffusion of the PCB and to estimate components' temperature [1][2][3][4][5][6][7][8][9][10][11][12][13][14]. Historically, some modeling methods of analyzing the effective thermal conductivity of the PCB structure were investigated, such as the method of deriving the lumped thermal conductivity of the PCB [1,2] and the method of deriving the discrete thermal conductivity of orthogonal anisotropy (x, y, z direction in Cartesian coordinate) based on the PCB wiring diagram [3,4].…”
Section: Introductionmentioning
confidence: 99%
“…Historically, some modeling methods of analyzing the effective thermal conductivity of the PCB structure were investigated, such as the method of deriving the lumped thermal conductivity of the PCB [1,2] and the method of deriving the discrete thermal conductivity of orthogonal anisotropy (x, y, z direction in Cartesian coordinate) based on the PCB wiring diagram [3,4]. In recent years, equivalent thermal-resistance models of the PCB [5][6][7] have been also researched. Two analytical thermal-resistance models and design optimization methods were proposed for optimizing the layout of PCB vias and thermal pads under the IC [5].…”
Section: Introductionmentioning
confidence: 99%
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