Thermal aspect of material selection for substrate board equipped with high heat flux IC chips

Durgam, Shankar; Bhosale, Ajinkya; Bhosale, Vivek; Deshpande, Revati; Sutar, Pankaj

doi:10.1088/1757-899x/1091/1/012005

Cited by 3 publications

(2 citation statements)

References 21 publications

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“…They proposed artificial neural network as alternative tool to CFD. Durgam et al [13,14,15,16] have used machine learning algorithms viz. support vector regression, XG Boost, random forest regression, and artificial neural network as an alternative to simulation software for cooling of heaters with dummy components on PCB under forced convection.…”

Section: Introductionmentioning

confidence: 99%

Computational cooling performance of electronic chips on printed circuit boards

Durgam¹

2022

J. Phys.: Conf. Ser.

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Effect of cooling performance of heated modules resembling integrated circuit (IC) chips on printed circuit boards (PCBs) under natural and forced convection is investigated. Commercially available four different types of substrate materials viz. silica glass, glass epoxy FR4, bakelite, and copper-clad board (CCB) is used for the simulation study. Natural and forced convection cooling scenarios are used for thermal performance with a power input of 7.5 W and 15 W for heaters equipped on a substrate. The main motive of this work is to present and compare thermal performance of heated modules on different substrate materials. Results of FR4 and bakelite with a power input of 7.5 under natural convection are compared with forced convection results at Re = 500 for the same power input. The results show that copper clad boards give a better cooling performance in natural convection scenarios for both the power inputs of 7.5 W and 15 W.

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Section: Introductionmentioning

confidence: 99%

Computational cooling performance of electronic chips on printed circuit boards

Durgam¹

2022

J. Phys.: Conf. Ser.

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“…Their findings showed that flow in the fan-drawing system was steady and uniform, which could be simulated using a laminar flow model. Moreover, Durgam et al (2021) presented that the distribution of the temperature on RPCB strongly depends on the position of heaters, Reynolds number (Re), the thermal conductivity of RPCB.…”

Section: Introductionmentioning

confidence: 99%

Optimization of flexible printed circuit board’s cooling with air flow and thermal effects using response surface methodology

Lim

Abdullah

Aziz

et al. 2021

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Purpose This study aims to investigate the interaction of independent variables [Reynolds number (Re), thermal power and the number of ball grid array (BGA) packages] and the relation of the variables with the responses [Nusselt number ((Nu) ¯ ), deflection/FPCB’s length (d/L) and von Mises stress]. The airflow and thermal effects were considered for optimizing the Re of various numbers of BGA packages with thermal power attached on flexible printed circuit board (FPCB) for optimum cooling performance with least deflection and stress by using the response surface method (RSM). Design/methodology/approach Flow and thermal effects on FPCB with heat source generated in the BGA packages have been examined in the simulation. The interactive relationship between factors (i.e. Re, thermal power and number of BGA packages) and responses (i.e. deflection over FPCB length ratio, stress and average Nusselt number) were analysed using analysis of variance. RSM was used to optimize the Re for the different number of BGA packages attached to the FPCB. Findings It is important to understand the behaviour of FPCB when exposed to both flow and thermal effects simultaneously under the operating conditions. Maximum d/L and von Misses stress were significantly affected by all parametric factors whilst (Nu)¯ is significantly affected by Re and thermal power. Optimized Re for 1–3 BGA packages with maximum thermal power applied has been identified as 21,364, 23,858 and 29,367, respectively. Practical implications This analysis offers a better interpretation of the parameter control in FPCB with optimized Re for the use of force convection electronic cooling. Optimal Re could be used as a reference in the thermal management aspect in designing the BGA package. Originality/value This research presents the parameters’ effects on the reliability and heat transfer in FPCB design. It also presents a method to optimize Re for the different number of BGA packages attached to increase the reliability in FPCB’s design.

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Geometric modification and placement of high heat flux ic chips on substrates of different materials for enhanced heat transfer

DURGAM,

BHOSALE,

BHOSALE

2023

Journal of Thermal Engineering

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This article presents the significance of using different sizes and positions of IC (Integrated Circuit) chips that are mounted on substrates of different materials. The ICs are cooled by forced convection in a horizontal wind tunnel. COMSOL Multiphysics 5.4 solve the IC chip cooling problem by selecting a conjugate heat transfer module with laminar flow. FR4, ba-kelite, single and multi-layer copper clad boards are used as substrate materials. Numerical simulations are performed for FR4, bakelite with a constant heat flux of 5000 W/m2, at 2.5 m/s air velocity. In contrast, single and multi-layer copper clad boards are studied for 10000 W/m2 with 1.5 m/s air velocity. The prime objective of this research is to use adequate size and placement of chips generating high heat fluxes for enhanced heat transfer. Results showed that larger chips placed at bottom rows and sequentially decreasing sizes in the subsequent rows for the same overall input for high substrate thermal conductivity give more heat dissipation. Among all configurations A0 – F considered in the study, case E provides minimum tempera-ture using single and multi-layer copper clad boards. In addition to modification of chip sizes, geometric spacing of X1/X2 = 1.8 results in lower maximum temperature.

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Thermal aspect of material selection for substrate board equipped with high heat flux IC chips

Cited by 3 publications

References 21 publications

Computational cooling performance of electronic chips on printed circuit boards

Computational cooling performance of electronic chips on printed circuit boards

Optimization of flexible printed circuit board’s cooling with air flow and thermal effects using response surface methodology

Geometric modification and placement of high heat flux ic chips on substrates of different materials for enhanced heat transfer

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