Thermal and mechanical properties of Sn–Zn–Bi lead-free solder alloys

El-Daly, A.A.; Swilem, Y.; Makled, M.H.; El-Shaarawy, M.G.; Abdraboh, A. M.

doi:10.1016/j.jallcom.2009.04.108

Cited by 96 publications

(67 citation statements)

References 26 publications

(41 reference statements)

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“…For instance, McCormack and Jin [8] found that small additions of 5% In can improve the ductility of Sn-Zn base solders. It was found also that the wetting characteristics are improved when Ag is added [5] [13]. Moreover, Kim et al [6] found that with increasing of additional Bi content, the melting temperature decreased from 198.4˚C to 186.1˚C.…”

Section: Introductionmentioning

confidence: 96%

“…Apart from its favorable melting temperature of solder alloys, Sn-9Zn alloy has better mechanical properties than the conventional Sn-Pb solders [1] [2] [3], and a lower cost than other Lead-free solders alloys [4] [5]. Whenever such alloys are used for many electronic applications, they are subjected to yield many prob- https://doi.org/10.4236/eng.2018.…”

Section: Introductionmentioning

confidence: 99%

“…Whenever such alloys are used for many electronic applications, they are subjected to yield many prob- https://doi.org/10.4236/eng.2018. 101003 Engineering lems, such as, the tendency of oxidation and poor wetting ability [5]. Therefore, the researchers tried to add a third element to overcome the shortfalls of Sn-9Zn alloy.…”

Section: Introductionmentioning

confidence: 99%

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Enhancing the Creep Resistance of Sn-9.0Zn-0.5Al Lead-Free Solder Alloy by Small Additions of Sb Element

Eid¹,

Ramadan²,

Basaty³

2018

ENG

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The creep phenomenon is considered as one of the most important deformation mechanisms under working conditions. The present study has examined the microstructure and creep properties of Sn-9.0Zn-0.5Al solder alloy after adding a small amount of Antimony (Sb). Nominal compositions of Sb additions were chosen to be 0, 0.5, 1.0, and 1.5 wt.%. The minimum strain rate was reduced for the Sb containing solder alloy. The stress exponents, n, were found to be around 3.7 for all soldiers at 130˚C. The stress exponent increases as the temperature drops from 100˚C to 50˚C, except for the 1.0% Sb alloy, where n 5.3 -6.1 at all the temperature range (T = 50˚C, 100˚C and 130˚C). The results reveal that the Sb-containing solder alloys have better creep resistance with greater ductility than the Sb-free alloy due to solid solution strengthening, and intermetallic compound SnSb particle hardening.

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Section: Introductionmentioning

confidence: 96%

Section: Introductionmentioning

confidence: 99%

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Enhancing the Creep Resistance of Sn-9.0Zn-0.5Al Lead-Free Solder Alloy by Small Additions of Sb Element

Eid¹,

Ramadan²,

Basaty³

2018

ENG

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“…Numerous efforts has been made to develop lead (Pb)-free solders that are intended to be an alternative for the long-established family of Pb-containing solder alloys (Ref [1][2][3]. Due to a low cost coupled with melting point close to that of conventional Sn-Pb solders, the Sn-Zn-based alloys are recognized as a possible replacement for high Pb-containing solders that are still commonly used, particularly for high-temperature applications ( Ref 1,[4][5][6][7][8]. Therefore, studies on factors affecting material properties of these alloys are underway (Ref [2][3][4][5][6].…”

Section: Introductionmentioning

confidence: 99%

Relationship Between Mechanical Properties of Lead-Free Solders and Their Heat Treatment Parameters

Klasik

Sobczak

Pietrzak

et al. 2012

J. of Materi Eng and Perform

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The research was undertaken to establish mechanical properties of as-cast and heat-treated Sn-Zn-based alloys of binary and ternary systems as candidates for lead (Pb)-free solder materials for high-temperature applications. The heat treatment of as-cast alloys was made under different combinations of processing parameters (168 h/50°C, 42 h/80°C, and 24 h/110°C). The systematic study of structure-property relationships in Sn-Zn, Sn-Zn-Ag, and Sn-Zn-Cu alloys containing the same amount of Zn (4.5, 9, 13.5 wt.%) and 1 wt.% of either Ag or Cu was conducted to identify the effects of chemical composition and heat treatment processing parameters on the alloy microstructure and mechanical behavior. Structural characterization was made using optical microscopy and scanning electron microscopy techniques coupled with EDS analysis. Mechanical properties (initial YoungÕs modulus E, ultimate tensile strength UTS, elastic limit R 0.05 , yield point R 0.2 , elongation A 5 , and necking Z) were determined by means of static tensile tests. All the examined Sn-Zn-based alloys have attractive combination of mechanical characteristics, especially tensile strength, having values higher than that of common leaded solders and their substitutes of Pb-free SAC family. The results obtained demonstrate that the Sn-Zn-based alloys present competitive Pb-free solder candidates for high-temperature applications.

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“…Phase equilibrium plays an important role in the process of optimizing the composition of low-temperature lead-free solder. Owing to the low melting point and good wettability, the Sn-Bi alloy is treated as one important and representative choice of the low-temperature Pb-free solders [1][2][3]. The addition of rare earth (RE) elements can control and eliminate the negative effect of impurity elements, which improve the spreading property of Bi-based solder [4,5].…”

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confidence: 99%

Thermodynamic Study of Sn-Bi-Nd, Tb Ternary Systems

Chen

et al. 2017

IOP Conf. Ser.: Mater. Sci. Eng.

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Thermodynamic study and modelling of iron-based melts for adequate prediction of modern ladle metallurgy processes A I Zaitsev, I G Rodionova, N G Shaposhnikov et al. School of Materials Science and Engineering, Southwest Petroleum University, Chengdu 610000,China. E-mail:wsliang1465@126.comAbstract. The aim of this study was to investigate the effect of the addition of rare earth elements on Sn-Bi-based alloy, and to study the phase equilibrium of Sn-Bi-Nd,Tb ternary systems by means of establishing the thermodynamic database. Combined with the thermodynamic parameters of relevant binary systems, the thermodynamic database of the Sn-Bi-Nd, Tb ternary systems has been developed to present the significant information for the design of low-temperature lead-free solder alloys. IntroductionWith the development of modern technology, low-temperature lead-free solders are used more and more wildly in the field of low-temperature assembly. Phase equilibrium plays an important role in the process of optimizing the composition of low-temperature lead-free solder. Owing to the low melting point and good wettability, the Sn-Bi alloy is treated as one important and representative choice of the low-temperature Pb-free solders [1][2][3]. The addition of rare earth (RE) elements can control and eliminate the negative effect of impurity elements, which improve the spreading property of Bi-based solder [4,5]. Therefore, it is essential to understand the phase equilibria in the Sn-Bi-RE system. In the present work, combined with the assessed relevant binary systems, the thermodynamic database of the Sn-Bi-RE (RE=Nd,Tb) ternary systems have been developed and provides important information about phase equilibria and thermodynamic properties, such as stable and metastable phase equilibrium, phase fraction, mixing enthalpy, activity, Gibbs energy of formation, etc. which is very helpful to design new types of low-temperature lead-free solders.

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Thermal and mechanical properties of Sn–Zn–Bi lead-free solder alloys

Cited by 96 publications

References 26 publications

Enhancing the Creep Resistance of Sn-9.0Zn-0.5Al Lead-Free Solder Alloy by Small Additions of Sb Element

Enhancing the Creep Resistance of Sn-9.0Zn-0.5Al Lead-Free Solder Alloy by Small Additions of Sb Element

Relationship Between Mechanical Properties of Lead-Free Solders and Their Heat Treatment Parameters

Thermodynamic Study of Sn-Bi-Nd, Tb Ternary Systems

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