Theoretical Study on Decomposition Mechanism of Insulating Epoxy Resin Cured by Anhydride

Zhang, Xiaoxing; Wu, Yunjian; Chen, Xiaoyu; Wen, Hao; Xiao, Song

doi:10.3390/polym9080341

Cited by 46 publications

(34 citation statements)

References 33 publications

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“…The reactive force field ReaxFF can be used to evaluate the dynamic process of chemical reactions to simulate the fracture and formation of chemical bonds and to simulate complex chemical reactions of large systems at a high simulation speed. Reactive molecular dynamics (RMD) has been successfully applied to organic micromolecular systems, polymers, metal oxides, and other new materials [13,14,15,16,17,18,19,20].…”

Section: Introductionmentioning

confidence: 99%

Molecular Dynamics Simulations on the Thermal Decomposition of Meta-Aramid Fibers

Yin

Tang

Wang³

et al. 2018

Polymers

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The thermal decomposition mechanism of a meta-aramid fiber was simulated at the atomic level using the ReaxFF reactive force field. The simulation results indicated that the main initial decomposition positions of the meta-aramid fiber elements were C aromatic ring –N and C=O, which could be used as targets for the modification of meta-aramid fibers. The meta-aramid fiber elements first decomposed into C6–C13 and then into smaller segments and micromolecular gases. The temperature was shown to be the key factor affecting the thermal decomposition of the meta-aramid fibers. More complex compositions and stable gases were produced at high temperatures than at lower temperatures. HCN was a decomposition product at high temperature, suggesting that its presence could be used for detecting thermal faults in meta-aramid fibers. Generation path tracing of the thermal decomposition products NH 3 and H 2 O was also performed. NH 3 was produced when the NH 2 group captured an H atom adjacent to the system. H 2 O was formed after a carbonyl group captured an H atom, became a hydroxyl group, with subsequent intramolecular dehydration or intermolecular hydrogen abstraction.

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Section: Introductionmentioning

confidence: 99%

Molecular Dynamics Simulations on the Thermal Decomposition of Meta-Aramid Fibers

Yin

Tang

Wang³

et al. 2018

Polymers

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“…Epoxy resins are commonly cured by active hydrogen-containing compounds such as phenol novolac, bisphenol A novolac, dicyandiamide, and diamine [4][5][6][7][8][9][10][11][12][13]. However, the reaction product from active hydrogen and epoxy lead to a secondary alcohol.…”

Section: Introductionmentioning

confidence: 99%

High-Tg, Low-Dielectric Epoxy Thermosets Derived from Methacrylate-Containing Polyimides

et al. 2017

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Three methacrylate-containing polyimides (Px-MMA; x = 1-3) were prepared from the esterification of hydroxyl-containing polyimides (Px-OH; x = 1-3) with methacrylic anhydride. Px-MMA exhibits active ester linkages (Ph-O-C(=O)-) that can react with epoxy in the presence of 4-dimethylaminopyridine (DMAP), so Px-MMA acted as a curing agent for a dicyclopentadiene-phenol epoxy (HP7200) to prepare epoxy thermosets (Px-MMA/HP7200; x = 1-3) thermosets. For property comparisons, P1-OH/HP7200 thermosets were also prepared. The reaction between active ester and epoxy results in an ester linkage, which is less polar than secondary alcohol resulting from the reaction between phenolic OH and epoxy, so P1-MMA/HP7200 are more hydrophobic and exhibit better dielectric properties than P1-OH/HP7200. The double bond of methacrylate can cure at higher temperatures, leading to epoxy thermosets with a high-T g and moderate-to-low dielectric properties.

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“…found a very negligible improvement in degradation temperature utilizing GO, rGO and functionalized MWCNT as reinforcement . Such substantial enhancement in thermal stability of the composites reinforced with GO can be attributed to the homogeneous distribution and high aspect ratio of GO which inhibits the emission of degraded products (small gaseous molecules) such as CO 2 , CH 2 O, H 2 O and CO . Once the degradation started the rate of degradation increased with the addition of GO due to the separation of more stable oxygen functionalities.…”

Section: Resultsmentioning

confidence: 99%

Enhanced Epoxy/GO Composites Mechanical and Thermal Properties by Removing Air Bubbles with Shear Mixing and Ultrasonication

et al. 2019

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Epoxy‐graphene oxide composites were prepared through the homogeneous dispersion of graphene oxide (GO) in epoxy via shear mixing and ultrasonication techniques. Mechanical and thermal properties of the composites were evaluated. Final composite samples were characterized by Fourier transform infrared spectroscopy, scanning electron microscopy, optical microscope, differential scanning calorimetry, thermogravimetric analysis, and x‐ray diffraction analyses. The thickness of the prepared GO sheet was calculated by atomic force microscopy. Herein, we report a remarkable enhancement in thermal along with mechanical properties of diglycidyl ether of bisphenol‐A (DGEBA) based epoxy matrix upon adding small amounts (≤1.5 wt%) of GO into the glassy epoxy system. With the incorporation of only 0.5 wt% GO the tensile strength and Young's modulus were found to be increased by 67.4% and 43.2%, respectively compared to neat epoxy; in addition, 3.7 folds improvement was achieved in the impact strength at the same GO content. In agreement with mechanical properties, resulting composites also showed better thermal stability together with promising improvement in glass transition temperature. The glass transition temperature was enhanced by 25.8 °C for the composite with 0.1 wt% GO. Therefore, the prepared composite will have potential applicability in the field of material science with improved mechanical and thermal response.

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Theoretical Study on Decomposition Mechanism of Insulating Epoxy Resin Cured by Anhydride

Cited by 46 publications

References 33 publications

Molecular Dynamics Simulations on the Thermal Decomposition of Meta-Aramid Fibers

Molecular Dynamics Simulations on the Thermal Decomposition of Meta-Aramid Fibers

High-Tg, Low-Dielectric Epoxy Thermosets Derived from Methacrylate-Containing Polyimides

Enhanced Epoxy/GO Composites Mechanical and Thermal Properties by Removing Air Bubbles with Shear Mixing and Ultrasonication

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