The mechanism of ductile chip formation in cutting of brittle materials

Liu, Kui; Li, X. P.; Liang, Steven Y.

doi:10.1007/s00170-006-0531-5

Cited by 117 publications

(61 citation statements)

References 22 publications

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“…In fact, its actual working rake angle g ne is always large negative, which is resulting in a large compressive stress in the cutting region. In this scenario, work material fracturing due to pre-existing defects will be suppressed by the large cutting compressive stress undertook in the cutting region, meanwhile plastic deformation will dominate the chip formation [13]. DMC is like the plastic extrusion taken place ahead of the tool.…”

Section: Ductile Mode Cutting Mechanismmentioning

confidence: 99%

“…Later, precision grinding of brittle materials in a ductile mode had been extended to others such as silicon and ceramics. Further improvements in ultra-precision machining technology in the 1990s marked the progression for DMC to be applied in more advanced brittle materials such as different types of carbides [9][10][11][12][13][14][15][16]. Ductile mode cutting thus became an alternative way for finishing of brittle materials as it could produce crack-free mirror surface finish at a much higher efficiency and lower cost than polishing processes owing to its high material removal rate.…”

Section: Introductionmentioning

confidence: 99%

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A review on ductile mode cutting of brittle materials

2018

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Brittle materials have been widely employed for industrial applications due to their excellent mechanical, optical, physical and chemical properties. But obtaining smooth and damage-free surface on brittle materials by traditional machining methods like grinding, lapping and polishing is very costly and extremely time consuming. Ductile mode cutting is a very promising way to achieve high quality and crack-free surfaces of brittle materials. Thus the study of ductile mode cutting of brittle materials has been attracting more and more efforts. This paper provides an overview of ductile mode cutting of brittle materials including ductile nature and plasticity of brittle materials, cutting mechanism, cutting characteristics, molecular dynamic simulation, critical undeformed chip thickness, brittle-ductile transition, subsurface damage, as well as a detailed discussion of ductile mode cutting enhancement. It is believed that ductile mode cutting of brittle materials could be achieved when both crack-free and no subsurface damage are obtained simultaneously.

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Section: Ductile Mode Cutting Mechanismmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

A review on ductile mode cutting of brittle materials

2018

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“…3. It's known, the ductile chip formation is a result of large compressive and shear stresses in the chip formation zone, which shields the growth of pre-existing flaws [9]. Large compressive stress can be generated in the chip due to small value of undeformed chip thickness being smaller than the radius of the tool cutting edge.…”

Section: Resultsmentioning

confidence: 99%

Simulation of defect zones in scribed silicon wafers

Ogorodnikov¹,

Ogorodnikova²,

Tikhonov³

2010

IOP Conf. Ser.: Mater. Sci. Eng.

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Abstract. The paper presents the results of computer simulation of silicon wafers under scribe loading conditions. Finite Element (FE) analysis was applied to estimate a value of stresses and spread of defect zone around scratch line. It was revealed that due to impact of diamond tip, a complex stress-strain state is produced in the wafer, which is related to the appearance of defect zones in silicon. The approved methods of cutting simulation could be employed for various types of brittle materials to predict defects and damage of crystal during separation processing.

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“…Nevertheless, the phase transition enhances the plastic deformation. Second, the formation of material defects such as microcracks would be hindered under a compressive stress state [142]. Thus, compression introduced by the tool edge is critical for the ductile mode machining of brittle materials.…”

Section: Mechanisms Of Nanomanufacturingmentioning

confidence: 99%