2015 IEEE 65th Electronic Components and Technology Conference (ECTC) 2015
DOI: 10.1109/ectc.2015.7159782
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The intermetallic compound (IMC) growth and phase identification of different kinds of copper wire and Al pad thickness

Stuwart Fan
1
,
Louie Huang
2
,
Ming-Chi Ho
3
et al.
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Cited by 3 publications
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An Advanced Study on Ion Impurities on Solder Resist and the Solutions for High-Temperature Reliability Performance

Zhang1,
Kojima2
2016
2016 IEEE 66th Electronic Components and Technology Conference (ECTC)
1
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1
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An Advanced Study on Ion Impurities on Solder Resist and the Solutions for High-Temperature Reliability Performance

Zhang1,
Kojima2
2016
2016 IEEE 66th Electronic Components and Technology Conference (ECTC)
1
0
1
0
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Reduction of Ag Corrosion Rate During Decapsulation of Ag Wire Bond Packages

Kim
1
,
Hah
2
,
Moon
3
et al. 2019
2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
2
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Novel Decapsulation Method for Silver-Based Wire-Bond Semiconductor Packages With High Reliability Using Mixed Salt–Acid Chemistry

Kim
1
,
Hah
2
,
Moon
3
et al. 2019
IEEE Trans. Compon., Packag. Manufact. Technol.
1
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