1991
DOI: 10.1557/proc-224-55
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The Gettering and Electrical Activity of Ni, Au, and Cu in Epitaxial Si/Si(2%Ge)/Si during RTA

Abstract: A study of gettering and electrical activity of metallic impurities Ni, Au and Cu has been carried out on epitaxial Si/Si(2%Ge)/Si wafers containing interfacial misfit dislocations. The impurities were intentionally introduced from a backside deposited thin metal followed by rapid thermal annealing (RTA). Transmission Electron Microscopy (TEM) results indicate that the impurities were gettered along the misfit dislocations in near-surface regions either as Au precipitate colonies, or as NiSi2 and CuSi silicide… Show more

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Cited by 5 publications
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“…If metals are dissolved from foreign particles, this increases melt impurity levels and leads to a higher level of decoration of structural defects at the interface, also increasing the recombination activity 48,[78][79][80] of those defects in the crystal. Foreign metal-rich particles incorporated directly into the material as inclusions affect only a small volume Figure 8.…”
Section: On the Size And Distribution Of Inclusionsmentioning
confidence: 99%
“…If metals are dissolved from foreign particles, this increases melt impurity levels and leads to a higher level of decoration of structural defects at the interface, also increasing the recombination activity 48,[78][79][80] of those defects in the crystal. Foreign metal-rich particles incorporated directly into the material as inclusions affect only a small volume Figure 8.…”
Section: On the Size And Distribution Of Inclusionsmentioning
confidence: 99%