The effects of Ni addition on microstructure evolution and mechanical properties of solder joints undergoing solid-liquid electromigration

Qiu, Hongyu; Hu, Xiaowu; Jiang, Xiongxin; Li, Qinglin

doi:10.1016/j.matlet.2019.126609

Cited by 20 publications

(4 citation statements)

References 12 publications

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“…Some researchers found that the Cu 3 Sn and KVs are successfully suppressed with reinforcement of the minor amount of Ni in the Sn-based solder. [14,129,130] The nucleation of heterogeneous places and KVs are reduced by the hightemperature aging process on coated Cu and minimizes unstable diffusion. [29,110] The amount of Cu is very important in the reduction of void formation; because a higher amount of Cu diminishes the diffusion driving force and the degree of imbalance.…”

Section: Explanation For Suppression Of Void Nucleationmentioning

confidence: 99%

Nucleation and Location of Kirkendall Voids at the Tin‐Based Solder/Copper Joint: A Review

Pal

Bajaj²

2023

Adv Eng Mater

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Void nucleation is a critical issue in wetting because it negatively impacts the solder joint and diminishes its electrical and mechanical properties. Generally, the Kirkendall effect (unbalanced diffusion) and Kirkendall voids (KVs) are developed due to dissimilar diffusivities of species (Cu and Sn) in a diffusion process. However, voids are also nucleated in the supersaturating condition, creating an additional position at or inside the “Kirkendall voids” interface. Various factors (surface modification, reinforcement of fourth elements, substrate type, and impurities) and the environment also support the nucleation of voids. Many researchers have discussed that KVs are nucleated into to intermetallic compounds layers. Reviewing the significant parameters for developing the KV in solid–liquid and solid–solid conditions is essential. Hence, in this review, the potential process of development of the KVs, concepts of thermodynamics, chemical reactions, and growth kinetics are developed. The position and reduction of KVs nucleation are also explained in this paper.

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Section: Explanation For Suppression Of Void Nucleationmentioning

confidence: 99%

Nucleation and Location of Kirkendall Voids at the Tin‐Based Solder/Copper Joint: A Review

Pal

Bajaj²

2023

Adv Eng Mater

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“…In the past, the tin-lead solder was commonly used due to its good wettability and low melting point [1][2][3][4][5], but due to the consideration of environmental protection, this toxicity solder was forbidden to use by the regulation of hazardous substances (RoHS) and gradually replaced by lead-free solders in modern electronics industries [6][7][8][9][10]. As a kind of conventional lead-free solder, the Sn-58Bi has drawn a great deal of attention in the field of research owing to its excellent properties, such as the relatively low melting point (138 °C), superior creep resistance and high tensile strength [11][12][13][14].…”

Section: Introductionmentioning

confidence: 99%

Influences of Ni addition into Cu–xNi alloy on the microstructure evolution and mechanical property of Sn–58Bi/Cu–xNi solder joint

Cheng

et al. 2020

Appl. Phys. A

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In the current investigation, various mass fractions (0, 0.5, 1.5, 5 and 10 wt%) of Ni were doped into Cu substrate, and influences of Ni addition on the microstructure evolution and mechanical property of the Sn-58Bi/Cu-xNi solder joint were investigated. Results showed that the growth rate of intermetallic compound (IMC) would increase with the Ni addition added from 0 to 5 wt% and remarkably decreased for Sn-58Bi/Cu-10Ni joint system. It indicated that the growth rate of IMC layer would decrease when 10 wt% Ni was added into the alloy. Besides, the tensile strength reduced with increase in the IMC thickness, which was under the synergistic effect of increasing liquid-state reaction time and the content of Ni addition (0-5 wt%). Moreover, the fracture mechanism gradually transformed from ductile fracture mode to brittle fracture mode with the decrease in joint strength.

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“…Due to the toxicity and environmental concerns, the leady solders are gradually replaced by the lead-free solders, such as Sn-Ag, Sn-Bi, and Sn-Cu [1][2][3][4][5]. The Sn3.0Ag0.5Cu (SAC305) solder is considered as the most potential candidate because of good wettability, excellent mechanical properties, and thermal fatigue resistance [6][7][8][9]. It is generally accepted that the IMC has a great effect on the reliability of lead-free solder joint [9][10][11].…”

Section: Introductionmentioning

confidence: 99%

“…Fig 6. Fractured surface of SAC305/Ni(P)-Cu solder joints after aging at 150 °C for various times, a as-reflowed, b 24 h, c 120 h, d 240 h, e 360 h…”

mentioning

confidence: 99%

Fracture behavior and mechanical strength of sandwich structure solder joints with Cu–Ni(P) coating during thermal aging

et al. 2020

J Mater Sci: Mater Electron

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Coating at the interface of solder joint has a great impact on the growth behavior of intermetallic compounds (IMCs) and the mechanical properties. In this study, the sandwich structure samples of Cu/Sn3.0Ag0.5Cu/Cu solder joints with coatings of Ni(P) monolayer and dual Cu-Ni(P) layers on Cu substrate were designed to conduct the shear test. The mechanical strength, fracture modes, and fractographic morphologies of Sn3.0Ag0.5Cu/Cu, Sn3.0Ag0.5Cu/Ni(P)-Cu, and Sn3.0Ag0.5Cu/Cu-Ni(P)-Cu solder joints reflowed at 280 °C for 10 min and then aged at 150 °C for up to 360 h were investigated. Experimental results show that the mechanical strength of Sn3.0Ag0.5Cu/Cu solder joints firstly increased because of the pinning effect of IMC, and then decreased due to the brittleness of excessive growth of IMC during solid-state aging processes. The Sn3.0Ag0.5Cu/Cu solder joints presented ductile fracture, mixed fracture, and brittle fracture modes during shear testing processes. The shear strength of Sn3.0Ag0.5Cu/Ni(P)-Cu solder joints decreased to about 17 MPa after 120 h thermal aging. At the same time, the shear failure mode of Sn3.0Ag0.5Cu/Ni(P)-Cu solder joints changed from the ductile dominant fracture to the brittle dominant fracture. The shear strength of Sn3.0Ag0.5Cu/Cu-Ni(P)-Cu solder joints remained approximate 21 MPa and the fractured position always occurred inside the IMC layer regardless of aging time.

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The effects of Ni addition on microstructure evolution and mechanical properties of solder joints undergoing solid-liquid electromigration

Cited by 20 publications

References 12 publications

Nucleation and Location of Kirkendall Voids at the Tin‐Based Solder/Copper Joint: A Review

Nucleation and Location of Kirkendall Voids at the Tin‐Based Solder/Copper Joint: A Review

Influences of Ni addition into Cu–xNi alloy on the microstructure evolution and mechanical property of Sn–58Bi/Cu–xNi solder joint

Fracture behavior and mechanical strength of sandwich structure solder joints with Cu–Ni(P) coating during thermal aging

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