“…In SiGe alloys, the large difference in the mean free path between electron (approximately 5 nm) and phonon (approximately 200–300 nm) contributions leads to a strong influence of nanostructuring in a range of 10–100 nm, which reduces the thermal conductivity without significantly reducing the electrical conductivity [ 182 ]. Therefore, nanostructuring [ 183 , 184 , 185 ] and the use of nanoinclusions [ 184 , 186 , 187 , 188 , 189 ] are common strategies to further improve the thermoelectric properties of SiGe alloys. For preparation of SiGe alloys, solid-state ball milling [ 180 , 183 , 186 , 187 , 190 , 191 , 192 , 193 , 194 ] or melt spinning (MS) [ 182 , 189 ] in combination with subsequent SPS are commonly used.…”