The Effect of Adhesive Additives on the Properties of Uncured Sealants Based on Butyl Rubber

Galimzyanova, R. Yu.; Lisanevich, Maria S.; Khakimullin, Yu. N.

doi:10.1134/s1995421221030059

Cited by 1 publication

(1 citation statement)

References 5 publications

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“…Typical additives for butyl sealants are alkylphenol–formaldehyde resins (APFRs); gum rosin; hydrocarbon resins; low-molecular-weight polyisobutylene [ 67 ], paraffinic oil [ 68 ], C5 resin [ 69 ], high-molecular-weight polyisobutylene, silane-modified poly-alfa-olefin [ 70 ], butyl rubber, butadiene-styrene, and butadiene–nitrile rubbers, acrylic polymers, among other oligomers, polymers, and mixtures thereof, as well as natural and precipitated calcium carbonate silica [ 71 ], montmorillonites [ 71 ], sepiolite [ 72 ], carbon black [ 68 ], titanium dioxide [ 69 ], fumed silica, and halloysite [ 73 ]. Therefore, there is a large base of additives for HMA formulations, including organic and inorganic materials; however, usually, each one has a specific role, such as rheology or tackiness modifier, extender, pigment, etc.…”

Section: Hot-melt Adhesive Compositionmentioning

confidence: 99%

Organosilicon Compounds in Hot-Melt Adhesive Technologies

Czakaj,

Sztorch,

Romanczuk-Ruszuk

et al. 2023

Polymers

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Hot-melt adhesives (HMAs) are thermoplastic materials that can bond various substrates by solidifying rapidly upon cooling from the molten state, and their modification with organosilicon compounds can result in crosslinking behavior, characteristic of gels. Organosilicon compounds are hybrid molecules that have both inorganic and organic components and can enhance the properties and performance of HMAs. The gel aspect of HMA with and without organosilicon modifiers can be considered in organosilicon-modified systems, the modifiers are often either sol–gel condensation products or their mechanism of action on the adherent surface can be considered of sol–gel type. The purpose of this manuscript is to present the current state of the art on the formulation, characterization, and application of HMAs and optimize their performance with organosilicon compounds for application in various industries such as automotive, construction, and photovoltaics. This review covers articles published within the period of 2018–2022. The article is divided into sections, in which information about hot-melt adhesives is described at the beginning. The following part of the presented review focuses on the composition of hot-melt adhesives, which takes into account the use of organosilicon compounds. The last part of this review outlines the future trends in hot-melt adhesives.

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