The anion effect of the morphology and preferred orientation of copper deposit under pulse current conditions

Tzeng, G.S.; Wan, Chi‐Chao

doi:10.1016/0254-0584(91)90163-o

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2017

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“…For example, smaller grains have been observed in Cu films with higher PCD, since the higher current densities result in faster nucleation rates from increased cathodic overpotential [12–15]. Increased bath temperature also gives rise to larger grain sizes in Cu films [14,15]. Furthermore, metal grain size and twinning have been found to be correlated in pulse electrodeposited copper films [12,16].…”

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confidence: 99%

The influence of pulse plating frequency and duty cycle on the microstructure and stress state of electroplated copper films

et al. 2017

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In this work we studied the impact of pulse electroplating parameters on the cross-sectional and surface microstructures of blanket copper films using electron backscattering diffraction and x-ray diffraction. The films evaluated were highly (111) textured in the direction perpendicular to the film surface. The degree of preferential orientation was found to decrease with longer pulse on-times, due to strain energy driven growth of other grain orientations. Residual biaxial stresses were also measured in the films and higher pulse frequencies during deposition led to smaller biaxial stresses in the films. Film stress was also found to correlate with the amount of twinning in the copper film cross-sections. This has been attributed to the twins’ thermal stability and mechanical properties.

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