Test beam results of 3D silicon pixel sensors for the ATLAS upgrade

Grenier, P.; Alimonti, G.; Barbero, M.; Bates, R. L.; Bolle, E.; Borri, M.; Boscardin, M.; Buttar, C. M.; Capua, M.; Cavalli‐Sforza, M.; Cobal, M.; Cristofoli, Andrea; Betta, G.-F. Dalla; Darbo, G.; Viá, C. Da; Devetak, E.; DeWilde, B.; Girolamo, B. Di; Dobos, D.; Einsweiler, K.; Esseni, D.; Fazio, S.; Fleta, C.; Freestone, J.; Gallrapp, C.; Garcia-Sciveres, M.; Gariano, G.; Gemme, C.; Giordani, M. P.; Gjersdal, H.; Grinstein, S.; Hansen, Teis; Hansson, P.; Hasi, J.; Helle, Karen B.; Hoeferkamp, M. R.; Huegging, F.; Jackson, P.; Jakobs, K.; Kalliopuska, J.; Karagounis, M.; Kenney, C.; Köhler, Michael H.; Kocian, M.; Kok, Angela; Kolya, S. D.; Korokolov, I.; Kostyukhin, V. V.; Krüger, H.; Rosa, A. La; Lai, C. H.; Lietaer, Nicolas; Lozano, M.; Mastroberardino, A.; Micelli, A.; Nellist, C.; Oja, Aarne; O’Shea, V.; Aranda, C. Padilla; Palestri, Pierpaolo; Parker, S. I.; Parzefall, U.; Pater, J. R.; Pellegrini, G.; Pernegger, H.; Piemonte, C.; Pospı́šil, S.; Povoli, Marco; Roe, S.; Røhne, O.; Ronchin, S.; Rovani, A.; Ruscino, E.; Sandaker, H.; Seidel, S. C.; Selmi, L.; Silverstein, D.; Sjøbæk, K.; Slavíček, T.; Stapnes, S.; Stugu, B.; Stupak, J.; Su, D.; Susinno, G.; Thompson, R. J.; Tsung, J.-W.; Tsybychev, D.; Watts, S.; Wermes, N.; Young, C.; Zorzi, N.

doi:10.1016/j.nima.2011.01.181

Cited by 23 publications

(13 citation statements)

References 15 publications

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“…Tilted tracks deliver again nearly 100 % efficiency. [7] 2) Cell Efficiency To assess the relative loss of efficiency even after irradiation in a better way, we measured the cell efficiency. Fig.…”

Section: ) Hit Efficiencymentioning

confidence: 99%

Overview of the Insertable B-Layer (IBL) project of the ATLAS experiment at the large hadron collider at CERN

Flick

2013

2013 3rd International Conference on Advancements in Nuclear Instrumentation, Measurement Methods and Their Applications (ANIMM

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The ATLAS experiment will upgrade its Pixel Detector with the installation of a new pixel layer in 2013/14. The new subdetector, named Insertable B-Layer (IBL), will be installed between the existing Pixel Detector and a new smaller diameter beam-pipe at a radius of 33 mm. To cope with the high radiation and hit occupancy due to the proximity to the interaction point, a new read-out chip and two different silicon sensor technologies (planar and 3D) have been developed and are currently under investigation and production for the IBL. Furthermore, the physics performance should be improved through the reduction of pixel size whereas targeting for a low material budget, pushing for a new mechanical support using lightweight staves and a CO2 based cooling system. An overview of the IBL project, the results of beam tests on different sensor technologies, testing of pre-series staves made before going into production in order to qualify the assembly procedure, the loaded module electrical integrity, and the read-out chain will be presented.

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Section: ) Hit Efficiencymentioning

confidence: 99%

Overview of the Insertable B-Layer (IBL) project of the ATLAS experiment at the large hadron collider at CERN

Flick

2013

2013 3rd International Conference on Advancements in Nuclear Instrumentation, Measurement Methods and Their Applications (ANIMM

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“…Planar pixel sensors are used widely already in present high energy physics experiments and have very well established manufacturing processes with very high yield and low costs. Still, at the irradiation levels expected in the inner pixel layers at the HL-LHC, they require high bias voltages and pose stronger constraints on the cooling systems, especially when comparing to emerging sensor technologies like 3D sensors [8], which still are affected by lower yield and higher production costs, but made significant progress over the last few years and will be used in the ATLAS IBL upgrade [9,10,11]. Besides radiation hardness studies, geometry optimization and cost reduction are the key topics, which will also be covered in this paper.…”

Section: The Atlas Planar Pixel Sensor Randd Projectmentioning

confidence: 99%

Recent results of the ATLAS upgrade planar pixel sensors R&D project

Weigell

2013

Nuclear Instruments and Methods in Physics Research Section A:

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To extend the physics reach of the LHC experiments, several upgrades to the accelerator complex are planned, culminating in the HL-LHC, which eventually leads to an increase of the peak luminosity by a factor of five to ten compared to the LHC design value.To cope with the higher occupancy and radiation damage also the LHC experiments will be upgraded. The ATLAS Planar Pixel Sensor R&D Project is an international collaboration of 17 institutions and more than 80 scientists, exploring the feasibility of employing planar pixel sensors for this scenario.Depending on the radius, different pixel concepts are investigated using laboratory and beam test measurements. At small radii the extreme radiation environment and strong space constraints are addressed with very thin pixel sensors active thickness in the range of (75-150) µm, and the development of slim as well as active edges. At larger radii the main challenge is the cost reduction to allow for instrumenting the large area of (7-10) m 2 . To reach this goal the pixel productions are being transferred to 6 inch production lines and more cost-efficient and industrialised interconnection techniques are investigated. Additionally, the n-in-p technology is employed, which requires less production steps since it relies on a single-sided process.An overview of the recent accomplishments obtained within the ATLAS Planar Pixel Sensor R&D Project is given. The performance in terms of charge collection and tracking efficiency, obtained with radioactive sources in the laboratory and at beam tests, is presented for devices built from sensors of different vendors connected to either the present ATLAS read-out chip FE-I3 or the new Insertable B-Layer read-out chip FE-I4. The devices, with a thickness varying between 75 µm and 300 µm, were irradiated to several fluences up to 2 · 10 16 n eq /cm 2 . Finally, the different approaches followed inside the collaboration to achieve slim or active edges for planar pixel sensors are presented.

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“…Therefore, the radiation hardness should be carefully studied in order to obtain useful information for the design and technology optimization. The FBK devices were previously tested both in laboratory [12] and in beam tests at CERN in pre-irradiation conditions [13], obtaining very good results. In order to study their radiation hardness, different irradiation campaigns were conducted, and irradiated detectors were measured again in a test beam at CERN [14] and in laboratory.…”

Section: Introductionmentioning

confidence: 99%

Characterization of proton irradiated 3D-DDTC pixel sensor prototypes fabricated at FBK

Rosa

Boscardin

Cobal

et al. 2012

Nuclear Instruments and Methods in Physics Research Section A:

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In this paper we discuss results relevant to 3D Double-Side Double Type Column (3D-DDTC) pixel sensors fabricated at FBK (Trento, Italy) and oriented to the ATLAS upgrade. Some assemblies of these sensors featuring different columnar electrode configurations (2, 3, or 4 columns per pixel) and coupled to the ATLAS FEI3 read-out chip were irradiated up to large proton fluences and tested in laboratory with radioactive sources. In spite of the non optimized columnar electrode overlap, sensors exhibit reasonably good charge collection properties up to an irradiation fluence of 2 x 10 15 n eq cm −2 , while requiring bias voltages in the order of 100 V. Sensor operation is further investigated by means of TCAD simulations which can effectively explain the basic mechanisms responsible for charge loss after irradiation.

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Test beam results of 3D silicon pixel sensors for the ATLAS upgrade

Cited by 23 publications

References 15 publications

Overview of the Insertable B-Layer (IBL) project of the ATLAS experiment at the large hadron collider at CERN

Overview of the Insertable B-Layer (IBL) project of the ATLAS experiment at the large hadron collider at CERN

Recent results of the ATLAS upgrade planar pixel sensors R&D project

Characterization of proton irradiated 3D-DDTC pixel sensor prototypes fabricated at FBK

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