Temperature influence on etching deep holes with SF6/O2 cryogenic plasma

Crăciun, G.; Blauw, M. A.; Drift, E. van der; Sarro, P.M.; French, P.J.

doi:10.1088/0960-1317/12/4/307

Cited by 50 publications

(23 citation statements)

References 5 publications

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“…We also confirmed that the proposed method is valid for Si(111) substrates (supplementary data S1). The crystallographic variation of etch rates is not significant at our experimental conditions, although it is known to affect to the etching profile at temperatures below 170 K [27,28]. …”

Section: Resultsmentioning

confidence: 99%

Silicon nano-well arrays for reliable pattern transfer and locally confined high temperature reactions

Wi¹,

Wilson²,

Lee³

et al. 2011

Nanotechnology

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Si nano-well arrays, with precisely controlled undercut Si sidewall profiles and flat bottomed pockets, enable uniform nanoscale pattern transfer from resists to metal deposits without degradation of the initial lithographic resolution, as verified by formation of arrays of Au nano-dots with 10 nm diameter. An additional functionality of the Si nano-wells as local nano-reactors, where the patterned material is enclosed in a Si pocket during high temperature reaction, is demonstrated by thermally inducing a phase transformation of the as-deposited A1 phase of FePt nano-dots to the high coercivity, chemically ordered L10 phase.

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Section: Resultsmentioning

confidence: 99%

Silicon nano-well arrays for reliable pattern transfer and locally confined high temperature reactions

Wi¹,

Wilson²,

Lee³

et al. 2011

Nanotechnology

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“…For 500 µm diameter holes it is estimated to be 7 µm min −1 . When the front surface of the wafer has been etched down to 13 µm, 45 min are then required to realize the membranes from the backside [16,17].…”

Section: Design and Fabricationmentioning

confidence: 99%

Biomimetic strain-sensing microstructure for improved strain sensor: fabrication results and optical characterization

Wicaksono

Vincent

Pandraud

et al. 2005

J. Micromech. Microeng.

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This paper describes the fabrication, and early optical characterization results of a new biomimetic strain-sensing microstructure. The microstructures were inspired from the campaniform sensillum, a highly sensitive strain sensor found in the exocuticle layer of insects. We investigate the natural strain-sensor characteristics by mimicking some of its simplest structural features. Blind-hole-and membrane-structural features were combined and fabricated as membrane-in-recess microstructure. To investigate the strain-sensing (or strain-amplifying) property of the microstructure, an optical characterization setup was devised based on the interference pattern formed by reflected laser beams from different surfaces of the microstructures. Preliminary qualitative analysis of the results obtained shows unsimilar intensity level changes as a function of spatial location on the membrane, thus indicated the biomimetic microstructure's strain-amplifying property. This property could be utilized for future improvement of currently available planar-based conventional strain sensors.

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“…It has independent control of radical and ion fluxes and substrate temperature as is described elsewhere [14]. These process setings proved to be adequate for etching holes and open structures [15]. Other process details can be referred to our previous report in [12,13].…”

Section: Design and Fabrication Of The Biomimetic Micromachined Strucmentioning

confidence: 99%

<title>Simple optical characterisation for biomimetic micromachined silicon strain-sensing structure</title>

Wicaksono¹,

Pandraud²,

French³

2005

SPIE Proceedings

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This paper presents an on-going work to develop micromachined silicon-based strain sensor inspired from the campaniform sensillum of insects. We present simple optical setup for the characterisation of a membrane-in-recess structure as an early stage in mimicking the natural sensor. The microstructure is a 500 nm-thick SiO 2 /SiN circular membrane, burried 13 µm from the surface of a 3x3 mm, 525 µm thick Si-chip. The chip was attached to a 45x10x0.525 mm Si beam. The simple optical characterisation setup is based on imaging the reflected laser beam from the biomimetic structure. Since an optical cavity between the membrane and the Si beams beneath was formed, ideal flat-parallel FabryPerot interferometer equation was applied to interpret the results semi-quantitatively. We obtained 2-D interference fringe pattern having 3 orders of maxima from the middle to the edge of the circular apperture, as a result of an initial internal membrane stress. The pattern changed non-linearly as we applied flexural strain from behind the beam up to 50 µm, most probably caused by nonlinear deflection of the membrane (i.e. the membrane did not deflect similarly as the beam beneath it). This phenomena might explain one of the strain-amplifying properties of this biomimetic strain sensing microstructure.

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Temperature influence on etching deep holes with SF6/O2 cryogenic plasma

Cited by 50 publications

References 5 publications

Silicon nano-well arrays for reliable pattern transfer and locally confined high temperature reactions

Silicon nano-well arrays for reliable pattern transfer and locally confined high temperature reactions

Biomimetic strain-sensing microstructure for improved strain sensor: fabrication results and optical characterization

<title>Simple optical characterisation for biomimetic micromachined silicon strain-sensing structure</title>

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