DOI: 10.4028/www.scientific.net/kem.416.28
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Abstract: The abrasive ice disc chemical mechanical polishing (AID-CMP) is a potential polishing process in the semiconductor industry to realize superior surface finish and planarity for semiconductor wafers. In this paper we investigated the temperature field during GaAs wafer AID-CMP process for a better understanding of AID-CMP. The results show that the AID outer temperature is higher than the inner, and the highest temperature in AID is at the wafer/AID contact zone. The increases of Pc, v, eh and tp will generate…

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