2008 Design, Automation and Test in Europe 2008
DOI: 10.1109/date.2008.4484671
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Temperature Control of High-Performance Multi-core Platforms Using Convex Optimization

Abstract: With technology advances, the number of cores integrated on a chip and their speed of operation is increasing. This, in turn is leading to a significant increase in chip temperature. Temperature gradients and hot-spots not only affect the performance of the system, but also lead to unreliable circuit operation and affect the life-time of the chip. Meeting the temperature constraints and reducing the hot-spots are critical for achieving reliable and efficient operation of complex multi-core systems. In this wor… Show more

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Cited by 51 publications
(71 citation statements)
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References 18 publications
(21 reference statements)
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“…where is the largest singular value of , we have (22) Combining the bounds (20) and (22) with the inequality mentioned earlier, we get (23) which proves the convergence of the algorithm given that the stepsize satisfies (24) The convergence rate is linear with the rate determined by the constant . This constant is minimized with the stepsize choice and is equal to .…”
Section: Convergence Proofmentioning
confidence: 98%
See 1 more Smart Citation
“…where is the largest singular value of , we have (22) Combining the bounds (20) and (22) with the inequality mentioned earlier, we get (23) which proves the convergence of the algorithm given that the stepsize satisfies (24) The convergence rate is linear with the rate determined by the constant . This constant is minimized with the stepsize choice and is equal to .…”
Section: Convergence Proofmentioning
confidence: 98%
“…In [18], energy aware task scheduling in real-time systems is posed as a convex optimization problem and solved using the ellipsoid method. For some work on using convex optimization for multiprocessor frequency assignment, and some experimental results, see [19] and [20].…”
Section: Introductionmentioning
confidence: 99%
“…The first one models the heat dissipation of integrated devices, while the second one models the metal wiring and the heat spreader. Though this model is simple, it is widely used in state-of-the-art works [Murali et al 2008;Coskun et al 2008aCoskun et al , 2008b. Moreover, this modeling approach has been proven to be accurate enough for system-level thermal characterization in the case of 3D MPSoC with liquid cooling technologies Sabry et al 2010].…”
Section: Heat Propagation Modelmentioning
confidence: 99%
“…For example, the work presented in [18,21,34] presents temperature control techniques for homogeneous multi-core systems through DVFS. Similarly, temperature aware task assignment and scheduling techniques are presented in [9,19].…”
Section: Related Workmentioning
confidence: 99%