Technology roadmapping for Power Supply in Package (PSiP) and Power Supply on Chip (PwrSoC)

Foley, Raymond; Waldron, Finbarr; Slowey, John; Alderman, A.; Narveson, Brian; O’Mathuna, S.C.

doi:10.1109/apec.2010.5433622

Cited by 19 publications

(7 citation statements)

References 9 publications

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“…Lately remaining research challenges have been described in [47], [48] This section is summarizing the remaining challenges common in all above described converters with repect to implementation in products. It is dividing the major (a) class-E inverter (b) class-E synchronous rectifier Fig.…”

Section: Challenges Of Vhf Convertersmentioning

confidence: 99%

Evolution of Very High Frequency Power Supplies

Knott

Andersen

Kamby

et al. 2014

IEEE J. Emerg. Sel. Topics Power Electron.

101

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Abstract-The ongoing demand for smaller and lighter power supplies is driving the motivation to increase the switching frequencies of power converters. Drastic increases however come along with new challenges, namely the increase of switching losses in all components. The application of power circuits used in radio frequency transmission equipment helps to overcome those. However those circuits were not designed to meet the same requirements as power converters. This paper summarizes the contributions in recent years in application of very high frequency (VHF) technologies in power electronics, shows results of the recent advances and describes the remaining challenges. The presented results include a self-oscillating gate-drive, air core inductor optimizations, an offline LED driver with a power density of 8.9 W/cm 3 and a 120 MHz, 9 W DC powered LED driver with 89 % efficiency as well as a bidirectional VHF converter. The challenges to be solved before VHF converters can be used effectively in industrial products are within those three categories: components, circuit architectures and reliability testing.

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Section: Challenges Of Vhf Convertersmentioning

confidence: 99%

Evolution of Very High Frequency Power Supplies

Knott

Andersen

Kamby

et al. 2014

IEEE J. Emerg. Sel. Topics Power Electron.

101

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“…This continues to be evident in more recent products which are making increased use of smaller scale packages particularly QFN (Quad-Flat No leads) and μBGA (micro-BGA) with the QFN style being preferred over the BGA due to an almost 5% thermal performance advantage at full load conditions. It is expected that this trend will continue and will ultimately progress to the use of highcurrent chip-scale packaging technologies as their increasing use in other IC packaging applications tends to reduce their cost [15], [16].…”

Section: Packaging Technologymentioning

confidence: 99%

Technology Roadmapping for Power Supply in Package (PSiP) and Power Supply on Chip (PwrSoC)

Waldron

Foley

Slowey

et al. 2013

IEEE Trans. Power Electron.

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This paper presents a review and summary of the PSMA "PSiP2PwrSoC" special project that investigated the technology and performance underpinning recent commercial developments in Power Supply in Package and Power Supply on Chip. The results of this study are based on the identification of more than 28 commercial products, six of which were analyzed in detail, both physically and electrically. The methodology of the project is described and some of the salient results of this benchmarking effort are presented. In this study, a representative subset of the available commercial products was selected and a comprehensive physical, electrical and thermal performance analysis was carried out. The objectives were to identify the components, materials and assembly technologies used, and to determine if the drive toward greater integration and higher power density affected the performance of newer devices. The results of the analysis were then used to determine the current state of the technology in this application space, to show how it has developed to date and to predict how it might progress in the future. These results are presented in a generic format that does not identify individual products. This project was co-sponsored by the PSMA and member companies. The final report of the project, which includes more detailed information on the reviews described here as well as considerable trending analysis, is now available.Index Terms-Power supply in package (PSiP), power supply on chip (PwrSoC).

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“…R EDUCING component count and increasing power density for dc-dc converters has been a dominant trend in power electronics [1], [2]. The ultimate step in this trend is integrating the entire power supply on chip (PwrSoC), preferably, through a process compatible with silicon manufacturing.…”

Section: Introductionmentioning

confidence: 99%

Modeling Microinductors With Thin-Film Alloy Magnetic Cores

Gaskill

Papou

Mohan

et al. 2014

IEEE Trans. Power Electron.

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This paper presents a compact nonlinear frequencydependent circuit model for microinductors with magnetic thinfilm cores. The model captures saturation, high-frequency eddy currents in the conductors and core, and capacitive effects. A modeling extraction algorithm is proposed that generates a passive and accurate circuit from current-biased small-signal impedance measurements. These measurements are wafer-level compatible and can readily be made using an impedance analyzer or vector network analyzer. The model is applicable to the most common microinductor topologies, including toroidal, stripline, and racetrack used for integrated power electronics applications. We demonstrate the model performance of these three different microinductor geometries with commercially available field solvers as well as actual device measurements for switched mode power supply applications. Field-solver simulations show that the model captures ac power loss significantly better than traditional models and captures the current waveforms within 4.5% error. Comparison of the model to device measurements results in an RMS error less than 7.1% in current waveform for a device transitioning in and out of saturation due to a 10-MHz rectangular pulse.Index Terms-DC-DC power conversion, eddy currents, equivalent circuit modeling, magnetic films, microinductor.

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Technology roadmapping for Power Supply in Package (PSiP) and Power Supply on Chip (PwrSoC)

Cited by 19 publications

References 9 publications

Evolution of Very High Frequency Power Supplies

Evolution of Very High Frequency Power Supplies

Technology Roadmapping for Power Supply in Package (PSiP) and Power Supply on Chip (PwrSoC)

Modeling Microinductors With Thin-Film Alloy Magnetic Cores

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